Patents by Inventor Fernando Juan

Fernando Juan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11701830
    Abstract: In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: July 18, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: James Elmer Abbott, Jr., David A. Champion, Fernando Juan
  • Patent number: 11618217
    Abstract: According to examples, a build module may include a housing, a build material chamber, and a build chamber. The build material chamber may be positioned beneath the build chamber in the housing and may include a moveable support member, in which a build material distributor is to supply successive layers of build material onto the moveable support member from the build material chamber. The build module may be removably insertable into a build receiver of an additive manufacturing system to allow the additive manufacturing system to solidify a portion of the successive layers received onto the moveable support member during the solidification process of the build material. The moveable support member may separate the build material chamber from the build chamber to block build material from the above the build material chamber from being received into the build material chamber during a solidification process of the build material.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: April 4, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Fernando Juan, Alejandro Manuel De Pena, Esteve Comas, Edward Dale Davis
  • Patent number: 11584076
    Abstract: According to examples, a build module may include a housing, a build material chamber, and a build chamber. The build material chamber may be positioned beneath the build chamber in the housing and may include a moveable support member, in which a build material distributor is to supply successive layers of build material onto the moveable support member from the build material chamber. The build module may be removably insertable into a build receiver of an additive manufacturing system to allow the additive manufacturing system to solidify a portion of the successive layers received onto the moveable support member during the solidification process of the build material. The moveable support member may separate the build material chamber from the build chamber to block build material from the above the build material chamber from being received into the build material chamber during a solidification process of the build material.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: February 21, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Fernando Juan, Alejandro Manuel De Pena, Esteve Comas, Edward Dale Davis
  • Patent number: 11485074
    Abstract: According to one example there is provided an apparatus for supplying build material to a three-dimensional printing system. The apparatus comprises a rotatable vane.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: November 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jose Manuel Grases, Pau Martin Vidal, Fernando Juan, Pablo Dominguez Pastor, Gerard Mosquera
  • Patent number: 11260591
    Abstract: According to one example there is provided a method of delivering build material from a build material store to a supply module. The method comprises moving, using a rotatable vane, a portion of build material from the supply module to the top of the supply module, and spreading the moved portion of build material across the support platform.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: March 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jordi Gimenez Manent, Jose Manuel Grases, Francisco Jaime, Fernando Juan, Pau Martin Vidal, Marius Valles
  • Patent number: 11167492
    Abstract: A build platform (100, 200, 300) for a printing station is described comprising a trolley (105, 205, 305, 405) and a print bucket (110, 210, 310, 410). The print bucket may be mounted on the trolley and may comprise coupling elements (115A, 115B, 215A, 215B, 315A, 315B, 415A, 415B), respectively engageable to receiving elements (120A, 120B, 220A, 220B, 320A, 320B, 420A, 420B) of the printing station (150, 250, 350, 450). The coupling elements may cause the print bucket to at least partially disengage from the trolley when the coupling elements engage with the receiving elements of the printing station.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: November 9, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Pol Morral, Fernando Juan, Pau Martin Vidal
  • Patent number: 11072027
    Abstract: A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: July 27, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Fernando Juan, Pau Martin Vidal, Esteve Comas, Jordi Gimenez Manent, Pol Morral, Pablo Dominguez Pastor
  • Publication number: 20210206083
    Abstract: In one example, a build material preparation subsystem. The subsystem includes a trough to house build material deliverable to a build bed and usable to form a layer of an object fabricated by additive manufacturing. An agitating tray is slidably disposed in the trough. A linear actuator is disposed adjacent an outside wall of the trough. A drive arm has a first end portion fixedly coupled to the agitating tray and a second end portion coupled to the linear actuator. The drive arm passes over a wall of the trough.
    Type: Application
    Filed: March 29, 2017
    Publication date: July 8, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Haseeb YUSEF, Fernando JUAN, Corwin David WHITEFIELD, Matt Gordon DRIGGERS, Gerard MOSQUERA DONATE
  • Patent number: 11014296
    Abstract: A transport device (106) includes a first volume (110) to receive a build material and a second volume (108) to contain an object created by an additive manufacturing system (100). The transport device (106) is receivable by a 3D printer (102) of the additive manufacturing system, and the 3D printer to build the object in the second volume. The transport device (106) is receivable by an extracting and supply device (104). The extracting and supply device is to extract the object from the second volume and to supply the build material to the first volume.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: May 25, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alejandro Manuel De Pena, Fernando Juan, Esteve Comas
  • Publication number: 20210122118
    Abstract: In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.
    Type: Application
    Filed: January 5, 2021
    Publication date: April 29, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: James Elmer Abbott, JR., David A. Champion, Fernando Juan
  • Patent number: 10953600
    Abstract: An apparatus (100) for generating three dimensional objects comprises a first scanning carriage (102). The first scanning carriage comprises a first energy source (104) to pre-heat an area of a build surface as the first scanning carriage (102) moves over the build surface.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: March 23, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alejandro Manuel De Pena, Esteve Comas, Fernando Juan
  • Publication number: 20210078250
    Abstract: According to examples, a build module may include a housing, a build material chamber, and a build chamber. The build material chamber may be positioned beneath the build chamber in the housing and may include a moveable support member, in which a build material distributor is to supply successive layers of build material onto the moveable support member from the build material chamber. The build module may be removably insertable into a build receiver of an additive manufacturing system to allow the additive manufacturing system to solidify a portion of the successive layers received onto the moveable support member during the solidification process of the build material. The moveable support member may separate the build material chamber from the build chamber to block build material from the above the build material chamber from being received into the build material chamber during a solidification process of the build material.
    Type: Application
    Filed: November 25, 2020
    Publication date: March 18, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Fernando JUAN, Alejandro Manuel DE PENA, Esteve COMAS, Edward Dale DAVIS
  • Publication number: 20210053287
    Abstract: An integrated build and material supply system for an additive manufacturing apparatus comprises a building compartment adapted to accommodate an object to be formed by means of additive manufacturing and a storage compartment adapted to store a build material for forming said object. A volume of said building compartment and a volume of said storage compartment are variable in size, and said system is adapted to re-allocate at least a portion of a volume previously allocated to said storage compartment to said building compartment.
    Type: Application
    Filed: November 6, 2020
    Publication date: February 25, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Alejandro Manuel De Pena, Fernando Juan, Pau Martin
  • Patent number: 10926466
    Abstract: An integrated build and material supply system (12) for an additive manufacturing apparatus comprises a building compartment (24) adapted to accommodate an object (50) to be formed by means of additive manufacturing and a storage compartment (22) adapted to store a build material for forming said object. A volume of said building compartment and a volume of said storage compartment are variable in size, and said system is adapted to re-allocate at least a portion of a volume previously allocated to said storage compartment to said building compartment.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: February 23, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alejandro Manuel De Pena, Fernando Juan, Pau Martin
  • Patent number: 10913208
    Abstract: In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: February 9, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Elmer Abbott, Jr., David A. Champion, Fernando Juan
  • Patent number: 10889059
    Abstract: A build module is provided. The build module may include a housing and a build material chamber in the housing to hold build material. The build module may include a build chamber in the housing. The build material chamber may be beneath the build chamber or next to the build chamber. The build chamber may include a moveable support member to receive successive layers of the build material from a build material distributor. The build module may be removably insertable into a build receiver of an additive manufacturing system to allow the additive manufacturing system to solidify a portion the successive layers to be received onto the movable support member.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: January 12, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Fernando Juan, Alejandro Manuel De Pena, Esteve Comas, Edward Dale Davis
  • Patent number: 10814608
    Abstract: A printing system may be provided. The printing system may include an agent distributor to selectively deliver at least one printing agent onto a substrate on a first type of supply module and a layer of build material on a second type of supply module. The printing system may include a controller to control the agent distributor to selectively deliver the at least one printing agent in patterns derived from data representing a slice of a three-dimensional object to be generated and representing an image to be generated on the substrate.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: October 27, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Megha Jaiswal, Rishi Sharma, Sanket Naik, Fernando Juan, Edward Dale Davis
  • Publication number: 20200147885
    Abstract: According to one example there is provided a method of delivering build material from a build material store to a supply module. The method comprises moving, using a rotatable vane, a portion of build material from the supply module to the top of the supply module, and spreading the moved portion of build material across the support platform.
    Type: Application
    Filed: January 14, 2020
    Publication date: May 14, 2020
    Inventors: Jordi Gimenez Manent, Jose Manuel Grases, Francisco Jaime, Fernando Juan, Pau Martin Vidal, Marius Valles
  • Patent number: 10647136
    Abstract: A print bar for a for a multi-pass printer, the print bar comprising a static part configured to extend across a print area of a print target and a moveable part comprising a print bar beam and printer comprising such a print bar.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: May 12, 2020
    Assignee: Hewett-Packard Development Company, L.P.
    Inventors: Joan Sanjuan, Fernando Juan, Eduardo Ruiz Martinez
  • Publication number: 20200114576
    Abstract: A transport device (106) includes a first volume (110) to receive a build material and a second volume (108) to contain an object created by an additive manufacturing system (100). The transport device (106) is receivable by a 3D printer (102) of the additive manufacturing system, and the 3D printer to build the object in the second volume. The transport device (106) is receivable by an extracting and supply device (104). The extracting and supply device is to extract the object from the second volume and to supply the build material to the first volume.
    Type: Application
    Filed: May 12, 2016
    Publication date: April 16, 2020
    Inventors: Alejandro Manuel De Pena, Fernando Juan, Esteve Comas