Abstract: An LED-based luminaire employs an LED module mounted to a housing. The LED module is advantageously configured to transmit heat generated by the LEDs across and/or through the module and to the housing for dispersal to the environment. LED modules can be configured with conductive or non-conductive cores, and may be configured to evacuate heat from one or both faces of the LED module. Further, multiple heat paths can be defined from components on an LED module to the housing and to the environment.

Abstract: A low-profile strip illumination device comprises a substrate supporting an elongate heat conductor and positively and negatively energized elongate rails. A plurality of spaced apart light emitting diodes (LEDs) are mounted so as to be powered by the elongate rails. The LEDs are arranged generally adjacent the elongate heat conductor so that a heat flow path is defined from each LED to the elongate heat conductor and to the environment.

Abstract: An LED-based luminaire employs an LED module mounted to a housing. The LED module is advantageously configured to transmit heat generated by the LEDs across and/or through the module and to the housing for dispersal to the environment. LED modules can be configured with conductive or non-conductive cores, and may be configured to evacuate heat from one or both faces of the LED module. Further, multiple heat paths can be defined from components on an LED module to the housing and to the environment.

Abstract: A low-profile strip illumination device comprises a substrate supporting an elongate heat conductor and positively and negatively energized elongate rails. A plurality of spaced apart light emitting diodes (LEDs) are mounted so as to be powered by the elongate rails. The LEDs are arranged generally adjacent the elongate heat conductor so that a heat flow path is defined from each LED to the elongate heat conductor and to the environment.

Abstract: A hermetic packaging technology for silicon Schottky die or any other two terminal solderable die. The technology uses a pressed ceramic frame, solid metal pads, a solid metal disc, metal seal rings, and a direct high temperature solder bond to the die. There are no intermediate straps or wires used to connect the die to the metal pads. The die is actually part of the final package, or it can be said that the package is built around the die. The device is hermetically sealed for use in high reliability applications such as military or space programs. All materials used in the technology are matched for coefficient of thermal expansion (CTE).

Abstract: A surface mount package for use with large area silicon device. The package uses a pressed ceramic frame and solid metal pads which are closely matched for coefficient of thermal expansion (CTE) to each other and to the silicon die. The package is specifically designed for large area die (greater than 0.0625 inches squared) and for high temperature eutectic alloy bonding. All materials of the package are CTE matched to each other and to silicon within 10%.