Abstract: In accordance with the present invention, there is provided multiple embodiments of a package-in-package semiconductor device including an RF package and a semiconductor die which are provided in a stacked arrangement and are each electrically connected to an underlying substrate through the use of conductive wires alone or in combination with conductive bumps. In certain embodiments of the present invention, the RF package and the semiconductor die are separated from each other by an intervening spacer which is fabricated from aluminum, or from silicon coated with aluminum. If included in the semiconductor device, the spacer is also electrically connected to the substrate, preferably through the use of conductive wires. The RF package, the semiconductor die, the spacer (if included) and a portion of the substrate are at least partially covered or encapsulated by a package body of the semiconductor device.

Abstract: The invention is directed to a method for producing Palladium alloy composite membranes that are useful in applications that involve the need to separate hydrogen from a gas mixture. The method includes providing a substrate for supporting a palladium alloy film, seeding the support surface with palladium crystallites to produce an activated surface, first plating, over the activated surface, a palladium film, second plating, over the palladium film, an alloying material other than silver, and annealing the porous substrate, palladium film, and alloying material so that there is intermetallic diffusion of the alloying material into the palladium film to produce a palladium alloy film over the porous substrate.

Abstract: In accordance with the present invention, there is provided multiple embodiments of a package-in-package semiconductor device including an RF package and a semiconductor die which are provided in a stacked arrangement and are each electrically connected to an underlying substrate through the use of conductive wires alone or in combination with conductive bumps. In certain embodiments of the present invention, the RF package and the semiconductor die are separated from each other by an intervening spacer which is fabricated from aluminum, or from silicon coated with aluminum. If included in the semiconductor device, the spacer is also electrically connected to the substrate, preferably through the use of conductive wires. The RF package, the semiconductor die, the spacer (if included) and a portion of the substrate are at least partially covered or encapsulated by a package body of the semiconductor device.

Abstract: The invention is directed to a method for producing Palladium alloy composite membranes that are useful in applications that involve the need to separate hydrogen from a gas mixture. Further, in one embodiment, a Pd alloy composite membrane is realized in which the Pd alloy film is 1 ?m or less in thickness and resistant to poisoning by sulfide compounds. Further, the Pd alloy composite membranes are applied to a number of applications, such a fuel reforming.

Abstract: The invention is directed to a method for producing Palladium alloy composite membranes that are useful in applications that involve the need to separate hydrogen from a gas mixture. Further, in one embodiment, a Pd alloy composite membrane is realized in which the Pd alloy film is 1 &mgr;m or less in thickness and resistant to poisoning by sulfide compounds. Further, the Pd alloy composite membranes are applied to a number of applications, such a fuel reforming.