Patents by Inventor Ferry Michael Postma

Ferry Michael Postma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8987677
    Abstract: The invention relates to a modulation device for use in a charged particle multi-beamlet lithography system. The device includes a body comprising an interconnect structure provided with a plurality of modulators and interconnects at different levels within the interconnect structure for enabling connection of the modulators to one or more pattern data receiving elements. A modulator includes a first electrode, a second electrode, and an aperture extending through the body. The electrodes are located on opposing sides of the aperture for generating an electric field across the aperture. At least one of the first electrode and the second electrode includes a first conductive element formed at a first level of the interconnect structure and a second conductive element formed at a second level of the interconnect structure. The first and second conductive elements are electrically connected with each other.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: March 24, 2015
    Assignee: Mapper Lithography IP B.V.
    Inventors: Marco Jan-Jaco Wieland, Ferry Michael Postma
  • Publication number: 20110266418
    Abstract: The invention relates to a modulation device for use in a charged particle multi-beamlet lithography system. The device includes a body comprising an interconnect structure provided with a plurality of modulators and interconnects at different levels within the interconnect structure for enabling connection of the modulators to one or more pattern data receiving elements. A modulator includes a first electrode, a second electrode, and an aperture extending through the body. The electrodes are located on opposing sides of the aperture for generating an electric field across the aperture. At least one of the first electrode and the second electrode includes a first conductive element formed at a first level of the interconnect structure and a second conductive element formed at a second level of the interconnect structure. The first and second conductive elements are electrically connected with each other.
    Type: Application
    Filed: October 26, 2010
    Publication date: November 3, 2011
    Applicant: Mapper Lithography IP B.V.
    Inventors: Marco Jan-Jaco Wieland, Ferry Michael Postma