Patents by Inventor Fery Riswan

Fery Riswan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8847335
    Abstract: A micro-electrochemical sensor contains magnetic compounds inserted within a substrate that exert a magnetic force of attraction on paramagnetic beads held in contact with an electrode. The magnetic compounds can be contained within a fluid that is introduced into a void in the substrate. The electrode can be spaced apart from the magnetic compounds by a dielectric multi-layer membrane. During the fabrication process, different layers within the membrane-electrode structure can be tuned to have compressive or tensile stress so as to maintain structural integrity of the membrane, which is thin compared with the size of the void beneath it. During a process of forming the structure of the sensor, the tensile stress in a TiW adhesion layer can be adjusted to offset a composite net compressive stress associated with the dielectric layers of the membrane. The membrane can also be used in forming both the electrode and the void.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: September 30, 2014
    Assignee: STMicroelectronics Pte Ltd.
    Inventors: Shian-Yeu Kam, Tien-Choy Loh, Ying Yu, Fery Riswan, Frederic Sala
  • Publication number: 20140061823
    Abstract: A micro-electrochemical sensor contains magnetic compounds inserted within a substrate that exert a magnetic force of attraction on paramagnetic beads held in contact with an electrode. The magnetic compounds can be contained within a fluid that is introduced into a void in the substrate. The electrode can be spaced apart from the magnetic compounds by a dielectric multi-layer membrane. During the fabrication process, different layers within the membrane-electrode structure can be tuned to have compressive or tensile stress so as to maintain structural integrity of the membrane, which is thin compared with the size of the void beneath it. During a process of forming the structure of the sensor, the tensile stress in a TiW adhesion layer can be adjusted to offset a composite net compressive stress associated with the dielectric layers of the membrane. The membrane can also be used in forming both the electrode and the void.
    Type: Application
    Filed: August 28, 2012
    Publication date: March 6, 2014
    Applicant: STMICROELECTRONICS PTE LTD.
    Inventors: Shian-Yeu Kam, Tien-Choy Loh, Ying Yu, Fery Riswan, Frederic Sala