Patents by Inventor Fifin Irzhann

Fifin Irzhann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked dies utilizing cross connection bonding wire
    Patent number: 6787901
    Abstract: An integrated circuit package is constructed by attaching lower dies to a substrate that has bond fingers deposited on its surface. One lower die and its associated bond fingers are located offset from the center of the substrate. The lower dies are electrically coupled to the substrate's bond fingers with lower bond wires. An upper die is stacked on at least one of the lower dies. The upper die is electrically coupled, with bond wires, to the lower die upon which it is mechanically coupled. Each of the lower dies may be coupled to the other lower die with bond wire bridges that span the lower bond wires. The upper die may be electrically coupled, with bond wire bridges, to any or all of the lower dies.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: September 7, 2004
    Assignee: Qualcomm Incorporated
    Inventors: Edward Reyes, Fifin Irzhann
  • Method and apparatus for die stacking
    Patent number: 6680219
    Abstract: An integrated circuit package is constructed by attaching lower dies to a substrate that has bond fingers deposited on its surface. One lower die and its associated bond fingers are located offset from the center of the substrate. The lower dies are electrically coupled to the substrate's bond fingers with lower bond wires. An upper die is stacked on at least one of the lower dies. The upper die is electrically coupled, with bond wires, to the lower die upon which it is mechanically coupled. Each of the lower dies may be coupled to the other lower die with bond wire bridges that span the lower bond wires. The upper die may be electrically coupled, with bond wire bridges, to any or all of the lower dies.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: January 20, 2004
    Assignee: Qualcomm Incorporated
    Inventors: Edward Reyes, Fifin Irzhann
  • Method and apparatus for die stacking
    Publication number: 20030102569
    Abstract: An integrated circuit package is constructed by attaching lower dies to a substrate that has bond fingers deposited on its surface. One lower die and its associated bond fingers are located offset from the center of the substrate. The lower dies are electrically coupled to the substrate's bond fingers with lower bond wires. An upper die is stacked on at least one of the lower dies. The upper die is electrically coupled, with bond wires, to the lower die upon which it is mechanically coupled. Each of the lower dies may be coupled to the other lower die with bond wire bridges that span the lower bond wires. The upper die may be electrically coupled, with bond wire bridges, to any or all of the lower dies.
    Type: Application
    Filed: October 28, 2002
    Publication date: June 5, 2003
    Inventors: Edward Reyes, Fifin Irzhann
  • METHOD AND APPARATUS FOR DIE STACKING
    Publication number: 20030034563
    Abstract: An integrated circuit package is constructed by attaching lower dies to a substrate that has bond fingers deposited on its surface. One lower die and its associated bond fingers are located offset from the center of the substrate. The lower dies are electrically coupled to the substrate's bond fingers with lower bond wires. An upper die is stacked on at least one of the lower dies. The upper die is electrically coupled, with bond wires, to the lower die upon which it is mechanically coupled. Each of the lower dies may be coupled to the other lower die with bond wire bridges that span the lower bond wires. The upper die may be electrically coupled, with bond wire bridges, to any or all of the lower dies.
    Type: Application
    Filed: August 17, 2001
    Publication date: February 20, 2003
    Inventors: Edward Reyes, Fifin Irzhann