Patents by Inventor Figen T. Akin

Figen T. Akin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tapered die-side bumps
    Publication number: 20080003715
    Abstract: Embodiments of the invention include apparatuses and methods relating to die-side bumps having a tapered cross-section. In one embodiment, the tapered die-side bump is electrically coupled to a solder bump on a package substrate.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Kevin J. Lee, Figen T. Akin, Kurt Schultz, Raman Vaidyanathan, Shane A. Nolen, Adwait Telang