Abstract: An apparatus for processing a specimen with two or more particle beams, wherein the specimen has a milled side that is processed by a first particle beam and observed by a second particle beam. The specimen is milled during a first milling operation by the first particle beam with the specimen in a first position. Thereafter, the specimen tilts in a second position around an axis of tilt of the specimen. Thereafter, the specimen is milled during a second milling operation. Milling can be performed during continuous tilting of the specimen around the axis of tilt. The axis of tilt of the specimen intersects the milled side. In all the aforementioned positions of the specimen, the second particle beam impinges on the milled side, which enables monitoring of the milling in real time.

Abstract: A device with an ion column and a scanning electron microscope comprises at least one column detector of signal electrons placed inside or on the ion column. Signal generated on the sample is detected on the column detector during landing of a broad beam generated by the scanning electron microscope on the sample surface.

Abstract: A scanning electron microscope comprises three objective lenses, including a distant objective lens and a close objective lens, which are of conventional type, and an immersion objective lens of the immersion type below the distant objective lens and the close objective lens. These three objective lenses can be controlled independently, therefor different combinations of active objective lenses can be achieved. The scanning electron microscope therefore offers various imaging modes. There is a possibility to switch between these imaging modes and therefore, choose the most suitable way of imaging for given application.

Abstract: A device with an ion column and a scanning electron microscope comprises at least one column detector of signal electrons placed inside or on the ion column. Signal generated on the sample is detected on the column detector during landing of a broad beam generated by the scanning electron microscope on the sample surface.

Abstract: A method and apparatus for processing a specimen with two or more particle beams, wherein the specimen has a milled side that is processed by a first particle beam and observed by a second particle beam. The specimen is milled during a first milling operation by the first particle beam with the specimen in a first position. Thereafter, the specimen tilts in a second position around an axis of tilt of the specimen. Thereafter, the specimen is milled during a second milling operation. Milling can be performed during continuous tilting of the specimen around the axis of tilt. The axis of tilt of the specimen intersects the milled side. In all the aforementioned positions of the specimen, the second particle beam impinges on the milled side, which enables monitoring of the milling in real time.

Abstract: An apparatus for processing a specimen with two or more particle beams, wherein the specimen has a milled side that is processed by a first particle beam and observed by a second particle beam. The specimen is milled during a first milling operation by the first particle beam with the specimen in a first position. Thereafter, the specimen tilts in a second position around an axis of tilt of the specimen. Thereafter, the specimen is milled during a second milling operation. Milling can be performed during continuous tilting of the specimen around the axis of tilt. The axis of tilt of the specimen intersects the milled side. In all the aforementioned positions of the specimen, the second particle beam impinges on the milled side, which enables monitoring of the milling in real time.

Abstract: A scanning electron microscope comprises three objective lenses, including a distant objective lens and a close objective lens, which are of conventional type, and an immersion objective lens of the immersion type below the distant objective lens and the close objective lens. These three objective lenses can be controlled independently, therefor different combinations of active objective lenses can be achieved. The scanning electron microscope therefore offers various imaging modes. There is a possibility to switch between these imaging modes and therefore, choose the most suitable way of imaging for given application.

Abstract: A method and apparatus for processing a specimen with two or more particle beams, wherein the specimen has a milled side that is processed by a first particle beam and observed by a second particle beam. The specimen is milled during a first milling operation by the first particle beam with the specimen in a first position. Thereafter, the specimen tilts in a second position around an axis of tilt of the specimen. Thereafter, the specimen is milled during a second milling operation. Milling can be performed during continuous tilting of the specimen around the axis of tilt. The axis of tilt of the specimen intersects the milled side. In all the aforementioned positions of the specimen, the second particle beam impinges on the milled side, which enables monitoring of the milling in real time.

Abstract: A charged particle beam device includes an electron source structured to generate an electron beam, the electron source being coupled to an electron column that at least partially houses a system structured to direct the electron beam toward a specimen positioned in a sample chamber to which the electron column is coupled, and an electron detector. The electron detector includes one or more assemblies positioned within the electron column or the sample chamber, each of the assemblies including an SiPM and a scintillator directly connected face-to-face to an active light sensing surface of the SiPM without a light transporting device being positioned in between the scintillator and the SiPM.

Abstract: A charged particle beam device includes an electron source structured to generate an electron beam, the electron source being coupled to an electron column that at least partially houses a system structured to direct the electron beam toward a specimen positioned in a sample chamber to which the electron column is coupled, and an electron detector. The electron detector includes one or more assemblies positioned within the electron column or the sample chamber, each of the assemblies including an SiPM and a scintillator directly connected face-to-face to an active light sensing surface of the SiPM without a light transporting device being positioned in between the scintillator and the SiPM.

Abstract: The present invention deals with a secondary electron detector (1), especially in a scanning electron microscope. The subject matter of the invention provides a secondary electrons detector (1) constituted by a sensor (2) located in a detector chamber (3), to which a vacuum air pump (10) is connected to produce vacuum inside the detector chamber (3), the detector chamber (3) being in its wall near to the active surface of the sensor (2) enclosed with a diaphragm featuring high resistance to the transmission of gas and low resistance to the transmission of the electrons. The electrically conductive grid (11) is produced either in the form of a copper screen or as a kapton membrane (12) with orifices (13) and it is equipped on both sides with conductive coating (14, 15). Outside the detector chamber (3), the electrically conductive grid (11) is covered with an input screen (18), which is usually of hemispherical shape and is connected to the low voltage source (19) of 80 to 150 V.

Abstract: The present invention deals with a secondary electron detector (1), especially in a scanning electron microscope. The subject matter of the invention provides a secondary electrons detector (1) constituted by a sensor (2) located in a detector chamber (3), to which a vacuum air pump (10) is connected to produce vacuum inside the detector chamber (3), the detector chamber (3) being in its wall near to the active surface of the sensor (2) enclosed with a diaphragm featuring high resistance to the transmission of gas and low resistance to the transmission of the electrons. The electrically conductive grid (11) is produced either in the form of a copper screen or as a kapton membrane (12) with orifices (13) and it is equipped on both sides with conductive coating (14, 15). Outside the detector chamber (3), the electrically conductive grid (11) is covered with an input screen (18), which is usually of hemispherical shape and is connected to the low voltage source (19) of 80 to 150 V.