Abstract: A micro-channel type evaporator suitable for cooling electronic components is provided having a plate-like body having an external coupling surface with the electronic component to be cooled. The plate-like body internally carries an inlet manifold for a two-phase cooling fluid and an outlet manifold for the fluid downstream of the heat exchange. The inlet and outlet manifolds are in fluid communication by means of a heat exchange chamber placed inside the plate-like body at the coupling surface and by means of unidirectional circulation means of the two-phase cooling fluid. The unidirectional circulation means (T) is housed in the plate-like body and is configured to allow circulation of the liquid phase of the fluid exclusively from the outlet manifold towards the inlet manifold.

Abstract: A cooling system for data centre, which data centre includes a plurality of servers associated to form a rack, each server being provided with one or more heat generating means. The system includes a plurality of first heat exchange circuits and second thermosyphon circuits. The overall configuration of the system being such that the second thermosyphon circuits are in fluid communication with each other according to a parallel connection.

Abstract: A cooling system for data centre, which data centre includes a plurality of servers associated to form a rack, each server being provided with one or more heat generating means. The system includes a plurality of first heat exchange circuits and second thermosyphon circuits. The overall configuration of the system being such that the second thermosyphon circuits are in fluid communication with each other according to a parallel connection.