Abstract: A TOSA can include: a light emitting element; and one or more heating elements thermally coupled to the light emitting element so as to provide a substantially constant heat generation profile and/or temperature profile across the TOSA during a light emitting element dormant period and a light emitting element firing period. The TOSA can include a controller operably coupled with the one or more heating elements so as to control the substantially constant heat generation profile and/or temperature profile. In one aspect, the one or more heating elements can include one or more dedicated heating elements. In one aspect, the one or more of the dedicated heating elements can include a resistor element or coil.

Abstract: An example embodiment includes a fiber optic integrated circuit (IC). The fiber optic IC includes an integrated power supply. The integrated power supply includes a filter, an active switch, and a pulse width modulator (“PWM”). The filter is configured to convert a signal to an output signal of the integrated power supply. The active switch is configured to control introduction of the signal to the filter. The PWM is configured to generate a PWM output signal that triggers the active switch.

Abstract: A method of compensating for electromagnetic radiation. The method may include measuring electromagnetic radiation emanating from circuitry at a first frequency and adjusting at least one of the electrical settings of the circuitry based on the measurement of the electromagnetic radiation to reduce the electromagnetic radiation at the first frequency emanating from the circuitry.

Abstract: Through its higher refractive index, a silicon grism can be used to reduce the Described herein are systems and methods for reducing optical aberrations in an optical system to decrease polarization dependent loss. Embodiments are provided particularly to define beam trajectories through an optical switching system which reduce off-axis aberrations. In one embodiment, a silicon grism is provided for reducing the curvature of the focal plane at an LCOS device in a wavelength selective switch (WSS) such that the separated polarization states converge at the LCOS at substantially the same point along the optical axis for all wavelengths. In this embodiment, an axial offset at the LCOS device will not produce large PDL at the coupling fibers. In another embodiment, a coupling lens having an arcuate focusing region is provided to address an offset in the optical beams, such that the separated polarization states couple symmetrically to respective output fibers.

Abstract: One embodiment includes a latching mechanism having a latch, a cam and a slider. The cam is configured to rotate about an axis of rotation. The cam is also configured to displace an end of the latch when the cam is rotated about the axis of rotation. The slider is operably connected to the cam and is configured to cause the cam to rotate about the axis of rotation.

Abstract: An optical subassembly (OSA) with an extended radio frequency (RF) pin. In one example embodiment, an OSA includes a header, a metallic ring, an RF insulator eyelet, and an RF pin. The header defines an insulator opening and includes an internal header surface. The metallic ring extends above the internal header surface and includes a metallic ring inner diameter substantially equivalent to a diameter of the insulator opening. The RF insulator eyelet is positioned partially in the insulator opening and partially in the metallic ring and defines an RF pin opening. The RF pin is positioned in the RF pin opening and extends through the insulator opening and the metallic ring.

Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.

Abstract: A modular device for an optical communication module configured to be coupled to an optical transmission medium. The modular device may include a first edge and a second edge and N number of electrical circuit channels between the first and second edges. Each electrical circuit channel may include at least one element configured to provide functionality for communicating optical signals through the optical transmission medium. The modular device may also have a width between the first and second edges so that each of the N number of electrical circuit channels of C number of modular devices aligns with one of P number of interface channels of an opto-electrical interface configured to be coupled to the optical transmission medium when C equals P/N and C is a whole number greater than zero.

Abstract: In an embodiment, a dual optical-electrical conversion (DOEC) module is described that includes an optical host interface, an optical network interface, and an integrated circuit. The optical host interface includes an optical transmitter and an optical receiver. The optical network interface includes an optical transmitter and an optical receiver. The integrated circuit conditions electrical signals communicated between the optical host interface and optical network interface. Optical signals received at and transmitted by the optical host interface may have different parameter requirements than optical signals received at and transmitted by the optical network interface, such as such as different wavelength parameters and/or fiber link length parameters.

Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.

Abstract: A communication assembly can include: a module device; a cage having a body defining a first open end that is configured to receive the module device therethrough and the body defining one or more first receiver members between the first end and a second end opposite of the first end, the one or more first receiver members having a first part of fastening system (e.g., two-part fastening system); and a heat sink adapted to be received into the cage so as to be thermally coupled with the module device, the heat sink having a body defining one or more second receiver members configured to receive the one or more first receiver members, the one or more second receiver members having a second part of the fastening system that couples with the first part of the fastening system.

Abstract: A method of accelerating the aging of a laser to thereby determine the reliability of the laser. The method includes an act of providing a laser die for reliability testing, an act of applying a plurality of short signal pulses to the laser die so as to simulate the aging of the laser die, and an act of ascertaining the reliability of the laser die based on its response to the plurality of short signal pulses.

Abstract: In one example embodiment, a pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device.