Patents by Inventor Fintan Mckiernan

Fintan Mckiernan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dicing a semiconductor wafer
    Patent number: 8551792
    Abstract: A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: October 8, 2013
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Adrian Boyle, Joseph Callaghan, Fintan McKiernan
  • DICING A SEMICONDUCTOR WAFER
    Publication number: 20120064695
    Abstract: A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer.
    Type: Application
    Filed: April 30, 2009
    Publication date: March 15, 2012
    Applicant: Electro Scientific Industries, Inc.
    Inventors: Adrian Boyle, Joseph Callaghan, Fintan Mckiernan