Patents by Inventor Fion Tan

Fion Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic connection components having bondable wires
    Patent number: 7268304
    Abstract: A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.
    Type: Grant
    Filed: April 21, 2005
    Date of Patent: September 11, 2007
    Assignee: Tessera, Inc.
    Inventors: Masud Beroz, Jae M. Park, Belgacem Haba, Fion Tan, Philip R. Osborn
  • Microelectronic connection components having bondable wires
    Publication number: 20050243529
    Abstract: A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.
    Type: Application
    Filed: April 21, 2005
    Publication date: November 3, 2005
    Applicant: Tessera, Inc.
    Inventors: Masud Beroz, Jae Park, Belgacem Haba, Fion Tan, Philip Osborn