Abstract: A device may include a surface at least partially defining an enclosed region, a plurality of fluids within the enclosed region, the plurality of fluids comprising at least a first fluid having a first acoustic impedance and a second fluid having a second acoustic impedance different from the first acoustic impedance, a first piezoelectric transducer disposed on the surface, the first piezoelectric transducer being configured to generate a first wave reception signal based, at least in part, on an ultrasonic return wave received through at least one of the plurality of fluids, and a processor coupled to the first piezoelectric transducer and configured to determine a measurement of a tilt of the device based, at least in part, on the first wave reception signal.

Abstract: A method to a fabricate high surface area, high performance supercapacitor includes include applying a metal layer to at least a portion of a nanostructure; after applying the metal layer, oxidizing the metal layer; applying a plurality of additional metal layers onto a previously oxidized metal layer; and after applying each additional metal layer, oxidizing the additional metal layer prior to applying a successive additional metal layer. The metal layers may include a composition comprising at least one metal, the at least one metal selected from the group consisting of ruthenium, titanium, manganese, vanadium, iron, tin, cobalt and nickel. Optionally, each of the additional metal layers may be applied using atomic layering deposition (ALD).

Abstract: Medical devices configured to direct sound waves to a body tissue of a subject are provided. The medical device includes a housing and a curved piezoelectric transducer, where the curved piezoelectric transducer is configured to direct sound waves produced by the curved piezoelectric transducer to the body tissue of the subject. Also provided are methods of directing sound waves to a body tissue of a subject using the subject medical devices. The subject medical devices and methods find use in a variety of applications where the treatment of a body tissue of a subject with sound waves is desired.

Abstract: Curved piezoelectric transducers are provided. The curved piezoelectric transducer includes a substrate, a curved support layer having a peripheral portion in contact with the substrate, and a curved piezoelectric element disposed on the curved support layer. Methods of making the curved piezoelectric transducers are also provided. The curved piezoelectric transducers, devices and methods find use in a variety of applications, including devices, such as electronics devices, having one or more (e.g., an array) of the curved piezoelectric transducers on a substrate.

Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.

Abstract: A method to a fabricate high surface area, high performance supercapacitor includes include applying a metal layer to at least a portion of a nanostructure; after applying the metal layer, oxidizing the metal layer; applying a plurality of additional metal layers onto a previously oxidized metal layer; and after applying each additional metal layer, oxidizing the additional metal layer prior to applying a successive additional metal layer. The metal layers may include a composition comprising at least one metal, the at least one metal selected from the group consisting of ruthenium, titanium, manganese, vanadium, iron, tin, cobalt and nickel. Optionally, each of the additional metal layers may be applied using atomic layering deposition (ALD).

Abstract: A variety of micromachined structures are disclosed for use in DC-tunable ultrasound transducers.

Abstract: A piezoelectric micro-machined ultrasonic transducer (PMUT) uses multiple electrodes, e.g., in a radial pattern for a disc, to improve performance. The multiple electrodes may be differentially driven to operate the PMUT in d31 mode (that is, with an applied electrical field perpendicular to the piezoelectrically-induced strain) where deflection relative to input voltage is increased and in-plane stresses are reduce, thus improving overall performance.

Abstract: A variety of micromachined structures are disclosed for use in DC-tunable ultrasound transducers.

Abstract: A MEMS device has a mass supported at least in part by a spring. Among other things, the spring has first and second layers, and first and a second electrodes. The first and second layers are between the first and second electrodes, and the first and second layers, which are oppositely polarized, form a bimorph.

Abstract: A microchip system has a package forming a hermetically sealed interior, and MEMS structure within the interior. The system also has a gas sensor for detecting the concentration of at least one of oxygen or hydrogen within the interior.

Abstract: A method for capping a MEMS wafer to form a hermetically sealed device. The method includes applying a glass bonding agent to the cap wafer and burning off organic material in the glass bonding agent. The cap wafer/glass bonding agent combination is then cleaned to reduce lead in the combination. The cleaning is preferably accomplished using an oxygen plasma. The MEMS device is coated with a WASA agent. The cap wafer is then bonded to the MEMS wafer by heating this combination in a capping gas atmosphere of hydrogen molecules in a gas such as nitrogen, argon or neon. This method of capping the MEMS wafer can reduce stiction in the MEMS device.

Abstract: A MEMS device has a mass supported at least in part by a spring. Among other things, the spring has first and second layers, and first and a second electrodes. The first and second layers are between the first and second electrodes, and the first and second layers, which are oppositely polarized, form a bimorph.

Abstract: A plastic, waveguide-fed, horn antenna is manufactured using a three-dimensional (3D), polymeric micro hot embossing process. Two cavity resonators may be designed to reduce the impedance mismatch between the pyramidal horn antenna and the feeding waveguide. The waveguide-fed antenna may be fabricated using a self-aligned 3D plastic hot embossing process followed by a selective electroplating and sealing process to coat an approximately 8 ?m-thick gold layer around the internal surfaces of the system. As such, this plastic, low-cost manufacturing process may be used to replace the expensive metallic components for millimeter-wave systems and provides a scalable and integrated process for manufacturing an array of antenna.

Abstract: A microchip system has a package forming a hermetically sealed interior, and MEMS structure within the interior. The system also has a gas sensor for detecting the concentration of at least one of oxygen or hydrogen within the interior.

Abstract: An actively tunable waveguide-based iris filter having a first part including a first portion of a deformable iris filter cavity having an inlet and an outlet; a second part operatively coupled with the first part and including a second portion of the deformable iris filter cavity having a deformable membrane operatively coupled with the first portion of a deformable iris filter cavity; the first portion and the second portion together forming the deformable iris filter cavity of the tunable waveguide-based iris filter; and means for moving the deformable membrane, whereby movement of the deformable membrane changes the geometry of the deformable iris filter cavity for causing a change in the frequency of a signal being filtered by the filter. The tunable filter is fabricated using a MEMS-based process including a plastic micro embossing process and a gold electroplating process. Prototype filters were fabricated and measured with bandwidth of 4.05 GHz centered at 94.79 GHz with a minimum insertion loss of 2.

Abstract: A method for capping a MEMS wafer to form a hermetically sealed device. The method includes applying a glass bonding agent to the cap wafer and burning off organic material in the glass bonding agent. The cap wafer/glass bonding agent combination is then cleaned to reduce lead in the combination. The cleaning is preferably accomplished using an oxygen plasma. The MEMS device is coated with a WASA agent. The cap wafer is then bonded to the MEMS wafer by heating this combination in a capping gas atmosphere of hydrogen molecules in a gas such as nitrogen, argon or neon. This method of capping the MEMS wafer can reduce stiction in the MEMS device.

Abstract: An actively tunable waveguide-based iris filter having a first part including a first portion of a deformable iris filter cavity having an inlet and an outlet; a second part operatively coupled with the first part and including a second portion of the deformable iris filter cavity having a deformable membrane operatively coupled with the first portion of a deformable iris filter cavity; the first portion and the second portion together forming the deformable iris filter cavity of the tunable waveguide-based iris filter; and means for moving the deformable membrane, whereby movement of the deformable membrane changes the geometry of the deformable iris filter cavity for causing a change in the frequency of a signal being filtered by the filter. The tunable filter is fabricated using a MEMS-based process including a plastic micro embossing process and a gold electroplating process. Prototype filters were fabricated and measured with bandwidth of 4.05 GHz centered at 94.79 GHz with a minimum insertion loss of 2.