Patents by Inventor Firyon Ko

Firyon Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11905356
    Abstract: An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: February 20, 2024
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Naoki Kawamoto, Firyon Ko, Taihei Koumoto
  • Publication number: 20230305400
    Abstract: An object is to provide a novel bismaleimide compound. The solution is a bismaleimide compound represented by formula (1): wherein A1 represents a direct bond, a divalent linking group represented by formula (1-1), (1-2), or (1-3): wherein ring a represents a benzene ring or a cyclohexane ring; X represents a direct bond or a divalent linking group; Z represents a monovalent substituent bonded to ring a; p, q, and r are the number of substituents Z, p and q represent an integer of 0 to 3, and r represents an integer of 0 to 2; or a divalent linking group other than this; at least one of a plurality of A1s is a divalent linking group represented by formula (1-1), (1-2), or (1-3); A2 represents a divalent linking group obtained by removing two carboxy groups from an aromatic dicarboxylic acid compound; Y represents a divalent linking group; and n is an average value of the number of repeating units and is a real number in a range of 1 to 100.
    Type: Application
    Filed: February 8, 2023
    Publication date: September 28, 2023
    Inventors: Naoki Kawamoto, Firyon Ko, Taihei Koumoto
  • Publication number: 20230250233
    Abstract: An object is to provide a novel bismaleimide compound.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 10, 2023
    Inventors: Naoki Kawamoto, Firyon Ko, Taihei Koumoto
  • Publication number: 20220298281
    Abstract: An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 22, 2022
    Inventors: Naoki Kawamoto, Firyon Ko, Taihei Koumoto