Abstract: A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.

Abstract: In one aspect, pixel architectures for employment in photodetector apparatus and systems are described herein. A pixel, in some embodiments, comprises a silicon substrate, and one more dielectric layers over the substrate. The dielectric layers, for example, can comprise silica (SiO2) and/or other suitable dielectric material(s). A photoactive region resides within the one or more dielectric layers, the photoactive region comprising a heterojunction formed of a first Group IVA semiconductor alloy epitaxially extending from an aperture passing through the one or more dielectric layers to the silicon substrate, and a second Group IVA semiconductor alloy extending epitaxially from the first Group IVA semiconductor alloy.

Abstract: A front connecting rod for a sunroof linkage, a sunroof linkage, and a sunroof assembly. The sunroof linkage is configured to drive front glass of a sunroof assembly to slide relative to rear glass, and the front connecting rod is configured to connect a glass-supporting rod of the sunroof linkage to a front slider. The front connecting rod may have an anti-turn-over structure, configured to be matched in shape to a sealing strip disposed on a peripheral edge of the rear glass, so as to prevent the sealing strip from turning over when the sunroof linkage drives the front glass to slide. The front connecting rod for a present sunroof linkage enables a sunroof to open to the maximum extent, and during sliding will not cause the sealing strip of the rear glass to be turned over and folded.

Abstract: The present invention relates to a liquid-crystal (LC) medium comprising polymerizable compounds, to its use for optical, electro-optical and electronic purposes, in particular in LC displays, especially in LC displays of the PSA (polymer sustained alignment) or SA (self-aligning) mode, to an LC display of the PSA or SA mode comprising the LC medium, and to a process of manufacturing the LC display using the LC medium, especially an energy-saving LC display and energy-saving LC display production process.

Abstract: A front connecting rod for a sunroof linkage, a sunroof linkage, and a sunroof assembly. The sunroof linkage is configured to drive front glass of a sunroof assembly to slide relative to rear glass, and the front connecting rod is configured to connect a glass-supporting rod of the sunroof linkage to a front slider. The front connecting rod may have an anti-turn-over structure, configured to be matched in shape to a sealing strip disposed on a peripheral edge of the rear glass, so as to prevent the sealing strip from turning over when the sunroof linkage drives the front glass to slide. The front connecting rod for a present sunroof linkage enables a sunroof to open to the maximum extent, and during sliding will not cause the sealing strip of the rear glass to be turned over and folded.

Abstract: A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.

Abstract: The present technology relates to a semiconductor device. The semiconductor device comprises: a plurality of dies stacked on top of each other, each of the dies comprising a first major surface, an IO conductive pattern on the first major surface and extended to a minor surface substantially perpendicular to the major surfaces to form at least one IO electrical contact on the minor surface, and the plurality of dies aligned so that the corresponding minor surfaces of all dies substantially coplanar with respect to each other to form a common flat sidewall, and a plurality of IO routing traces formed over the sidewall and at least partially spaced away from the sidewall. The plurality of IO routing traces are spaced apart from each other in a first direction on the sidewall, and each of IO routing traces is electrically connected to a respective IO electrical contact and extended across the sidewall in a second direction substantially perpendicular to the first direction on the sidewall.

Abstract: A toy vehicle playset includes a track portion, a repositionable lever, an actuator, and a repositionable engagement member. The repositionable lever is disposed adjacent to the track portion, where the repositionable lever is repositionable between a first position and a second position. The actuator and the engagement member are disposed on the track portion, with the engagement member being disposed proximate to the actuator. The engagement member is operatively coupled to the repositionable lever and the actuator. When the repositionable lever is in the first position, the engagement member remains unengaged with a toy vehicle as the toy vehicle travels over the track portion and engages the actuator. However, when the repositionable lever is in the second position, engagement of the actuator by the toy vehicle traveling over the track portion causes the engagement member to engage and flip the toy vehicle.

Abstract: The present technology relates to a semiconductor device. The semiconductor device comprises: a plurality of dies stacked on top of each other, each of the dies comprising a first major surface, an IO conductive pattern on the first major surface and extended to a minor surface substantially perpendicular to the major surfaces to form at least one IO electrical contact on the minor surface, and the plurality of dies aligned so that the corresponding minor surfaces of all dies substantially coplanar with respect to each other to form a common flat sidewall, and a plurality of IO routing traces formed over the sidewall and at least partially spaced away from the sidewall. The plurality of IO routing traces are spaced apart from each other in a first direction on the sidewall, and each of IO routing traces is electrically connected to a respective IO electrical contact and extended across the sidewall in a second direction substantially perpendicular to the first direction on the sidewall.