Abstract: In some implementations, an electro-optical device includes a first substrate including a first ground pad and a first signal pad; a second substrate including a second ground pad and a second signal pad, wherein the first signal pad and the second signal pad form a signal pad pair, wherein the first substrate is separated from the second substrate by less than a threshold amount; wherein the first substrate is configured to receive an optical component and the second substrate is configured to receive an electrical component that is couplable to the optical component via a wire bonding between the first signal pad and the second signal pad; and a planar ribbon bonding connecting the first ground pad to the second ground pad and diagonally crossing the wire bonding.

Abstract: In some implementations, an opto-electrical device includes a heatsink; a thermally conductive element disposed on a first region of a surface of the heatsink; an adaptive thickness thermally conductive pad disposed on the thermally conductive element; an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad; a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink; an opto-electrical chip disposed on the TEC; and a substrate disposed on the IC and the opto-electrical chip, wherein the substrate is configured to electrically connect the IC and the opto-electrical chip.

Abstract: There is described an RF waveguide array. The array comprises a substrate comprising a plurality of optical waveguides, each waveguide being elongate in a first direction. An electrical RF transmission line array is located on a face of the substrate and comprises a plurality of signal electrodes and a plurality of ground electrodes, each electrode extending in the first direction. Each signal electrode is positioned to provide a signal to two respective waveguides. The ground electrodes include at least one intermediate ground electrode positioned between each pair of signal electrodes. Each intermediate ground electrode includes a portion extending into the substrate.

Abstract: A chip comprising a bonding pad region and a transmission section. The bonding pad region has a first impedance, and is configured for electrical connection to an external transmission line. The transmission section extends away from the bonding pad region and has a second impedance. The bonding pad region is configured to enable field confinement and field matching between the bonding pad region and the external transmission line, and the second impedance is not equal to the first impedance.

Abstract: A radio frequency, RF, waveguide array. The array comprises a substrate and an electrical RF transmission line array. The substrate comprises a plurality of optical waveguides, each waveguide being elongate in a first direction. The electrical RF transmission line array is located on a face of the substrate and comprises a plurality of RF transmission lines. Each transmission line comprises a signal electrode and at least two ground electrodes located on either side of the signal electrode. Each electrode extends in the first direction. Each signal electrode is positioned to provide a signal to two respective waveguides, i.e. each RF transmission line is positioned adjacent to two respective waveguides. The ground electrodes include at least two intermediate ground electrodes positioned between each pair of signal electrodes. Intermediate ground electrodes of different RF transmission lines are separated from each other by channels.

Abstract: A radio frequency, RF, waveguide array. The array comprises a substrate and an electrical RF transmission line array. The substrate comprises a plurality of waveguides, each waveguide being elongate in a first direction. The electrical RF transmission line array is located on a face of the substrate and comprises a plurality of signal electrodes and at least two ground electrodes. Portions of the ground electrodes which are relatively distal from the signal electrodes have reduced height in the direction transverse to the substrate to reduce the amount of material required to produce them.

Abstract: A chip comprising a bonding pad region and a transmission section. The bonding pad region has a first impedance, and is configured for electrical connection to an external transmission line. The transmission section extends away from the bonding pad region and has a second impedance. The bonding pad region is configured to enable field confinement and field matching between the bonding pad region and the external transmission line, and the second impedance is not equal to the first impedance.

Abstract: There is described an RF waveguide array. The array comprises a substrate comprising a plurality of optical waveguides, each waveguide being elongate in a first direction. An electrical RF transmission line array is located on a face of the substrate and comprises a plurality of signal electrodes and a plurality of ground electrodes, each electrode extending in the first direction. Each signal electrode is positioned to provide a signal to two respective waveguides. The ground electrodes include at least one intermediate ground electrode positioned between each pair of signal electrodes. Each intermediate ground electrode includes a portion extending into the substrate.

Abstract: A radio frequency, RF, waveguide array. The array comprises a substrate and an electrical RF transmission line array. The substrate comprises a plurality of optical waveguides, each waveguide being elongate in a first direction. The electrical RF transmission line array is located on a face of the substrate and comprises a plurality of RF transmission lines. Each transmission line comprises a signal electrode and at least two ground electrodes located on either side of the signal electrode. Each electrode extends in the first direction. Each signal electrode is positioned to provide a signal to two respective waveguides, i.e. each RF transmission line is positioned adjacent to two respective waveguides. The ground electrodes include at least two intermediate ground electrodes positioned between each pair of signal electrodes. Intermediate ground electrodes of different RF transmission lines are separated from each other by channels.

Abstract: A radio frequency, RF, waveguide array. The array comprises a substrate and an electrical RF transmission line array. The substrate comprises a plurality of waveguides, each waveguide being elongate in a first direction. The electrical RF transmission line array is located on a face of the substrate and comprises a plurality of signal electrodes and at least two ground electrodes. Portions of the ground electrodes which are relatively distal from the signal electrodes have reduced height in the direction transverse to the substrate to reduce the amount of material required to produce them.

Abstract: A photonic assembly is described. The assembly comprises a substrate. An optical modulator (100) in or on the substrate has an output port coupled to an output waveguide (106) mounted in or on the substrate. A spiller waveguide (107, 108) is mounted in or on the substrate. The spiller waveguide (107, 108) has an input end (109, 110) physically separated from but proximate to the output waveguide (106) so as to collect light spilt from the output port or output waveguide (106). The modulator (106) may be a MZI modulator.

Abstract: A photonic assembly is described. The assembly comprises a substrate. An optical modulator (100) in or on the substrate has an output port coupled to an output waveguide (106) mounted in or on the substrate. A spiller waveguide (107, 108) is mounted in or on the substrate. The spiller waveguide (107, 108) has an input end (109, 110) physically separated from but proximate to the output waveguide (106) so as to collect light spilt from the output port or output waveguide (106). The modulator (106) may be a MZI modulator.

Abstract: An optical device integrated on a planar substrate is disclosed, comprising a Y-branch attenuator optically coupled to a Mach-Zehnder modulator. The device also comprises means for reducing a crosstalk caused by unguided radiation between the Y-branch attenuator and the Mach-Zehnder modulator. In one embodiment, the reduction of the crosstalk is obtained by connecting the Mach-Zehnder modulator to one arm of the Y-branch attenuator. The invention also comprises a transmitting module including the integrated device.

Abstract: An optical device integrated on a planar substrate is disclosed, comprising a Y-branch attenuator optically coupled to a Mach-Zehnder modulator. The device also comprises means for reducing a crosstalk caused by unguided radiation between the Y-branch attenuator and the Mach-Zehnder modulator. In one embodiment, the reduction of the crosstalk is obtained by connecting the Mach-Zehnder modulator to one arm of the Y-branch attenuator. The invention also comprises a transmitting module including the integrated device.