Patents by Inventor Flesch Aimé

Flesch Aimé has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7103960
    Abstract: A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of micro-contacts each joined together by a common base so that spaces are provided between the free ends of the contacts. A mold for the grid is filled with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, so as to produce a block when cured. The common base is removed so as to separate the contacts from one another within the block. Further machining exposes the opposite ends of micro-contacts so that a like number of contact faces or pads are provided at opposed surfaces of the backing layer. Improved transducer constructions are also disclosed.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: September 12, 2006
    Assignee: Vermon
    Inventor: Flesch Aimé
  • Publication number: 20030029010
    Abstract: A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of micro-contacts each joined together by a common base so that spaces are provided between the free ends of the contacts. The method includes placing the grid in a mold, filling the mold with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, curing the material in the mold so as to form a block formed by the cured absorbent material and the grid, and releasing the block from the mold. The common base is removed by, e.g., machining the grid, so as to separate the contacts from one another within the block. Further machining is used to expose the opposite ends of micro-contacts so that a like number of contact faces are provided at opposed surfaces of the backing layer so formed. The grid can be prepared in several ways.
    Type: Application
    Filed: October 21, 2002
    Publication date: February 13, 2003
    Inventor: Flesch Aime
  • Patent number: 6467138
    Abstract: This invention is provided a method for making a backing layer for an ultrasonic matrix array transducer useful in diagnostic imaging, non-destructive material testing and treatment of human organs. The method includes placing the grid in a mold, filling the mold with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, curing the material in the mold so as to form a block formed by the cured absorbent material and the grid, and releasing the block from the mold.
    Type: Grant
    Filed: May 24, 2000
    Date of Patent: October 22, 2002
    Assignee: Vermon
    Inventor: Flesch Aimé