Abstract: A switching mode power converter includes a DSC with a digital PWM module configured for complementary operation mode during normal operation. The control algorithm of the DSC is configured such that during an initialization stage immediately following power up of the device relevant digital PWM modules used for interleaving operation are reconfigured to temporarily operate in an independent operation mode with the duty cycle associated with each channel set at zero. The reconfigured digital PWM modules remain set in the independent operation mode for a predefined period of time. Once the predefined time period is reached, the reconfigured digital PWM modules are again reconfigured back to the original complementary operation mode configuration and the control algorithm resumes normal operation of the DSC and digital PWM modules.

Abstract: Embodiments of the invention include systems and methods for automatically predicting production yield for a circuit assembly according to attributes of its components and defect data mapped thereto. Embodiments receive a proposed design specification for a circuit assembly, including bill of materials (BOM) and schematic data, at a yield prediction environment. The yield prediction environment maps a set of attributes to each component in the BOM and maps a set of possible defects to each component according to its attributes. Defects may be further mapped to a manufacturing process assigned to populate each component in the circuit assembly. The defects are associated with predicted frequencies of occurrence, which can be used to roll up a yield prediction for the circuit assembly. Embodiments further allow “what-if” analyses to be performed so that different yield prediction results can be compared according to different form factor options and/or different manufacturing process options.

Abstract: Methods and systems for a complete vehicle ecosystem are provided. Specifically, systems that when taken alone, or together, provide an individual or group of individuals with an intuitive and comfortable vehicular environment. The present disclosure includes a universal chassis that may be mounted in the head unit of a vehicle. The chassis may accept one or more modules that each have common dimensions. With a common form factor, the universal chassis is configurable as different modules with different functionality may be inserted into the chassis with ease.

Abstract: Methods and systems for a complete vehicle ecosystem are provided. Specifically, systems that when taken alone, or together, provide an individual or group of individuals with an intuitive and comfortable vehicular environment. The present disclosure builds on integrating existing technology with new devices, methods, and systems to provide a complete vehicle ecosystem.

Abstract: Methods and systems for a complete vehicle ecosystem are provided. Specifically, systems that when taken alone, or together, provide an individual or group of individuals with an intuitive and comfortable vehicular environment. The present disclosure includes a system to recognize the drivers and/or passengers within the automobile. Based on the recognition, the vehicle may change a configuration of the automobile to match predetermined preferences for the driver and/or passenger. The configurations may also include the recognition of a unique set of gestures for the person. Further, the configuration can also include the tracking of health data related to the person.

Abstract: Methods and systems for a complete vehicle ecosystem are provided. Specifically, systems that when taken alone, or together, provide an individual or group of individuals with an intuitive and comfortable vehicular environment. The present disclosure builds on integrating existing technology with new devices, methods, and systems to provide a complete vehicle ecosystem.

Abstract: Methods and systems for a complete vehicle ecosystem are provided. Specifically, systems that when taken alone, or together, provide an individual or group of individuals with an intuitive and comfortable vehicular environment. The present disclosure builds on integrating existing technology with new devices, methods, and systems to provide a complete vehicle ecosystem.

Abstract: Methods and systems for a complete vehicle ecosystem are provided. Specifically, systems that when taken alone, or together, provide an individual or group of individuals with an intuitive and comfortable vehicular environment. The present disclosure builds on integrating existing technology with new devices, methods, and systems to provide a complete vehicle ecosystem.

Abstract: Methods and systems for a complete vehicle ecosystem are provided. Specifically, systems that when taken alone, or together, provide an individual or group of individuals with an intuitive and comfortable vehicular environment. The present disclosure builds on integrating existing technology with new devices, methods, and systems to provide a complete vehicle ecosystem.

Abstract: Methods and systems for a complete vehicle ecosystem are provided. Specifically, systems that when taken alone, or together, provide an individual or group of individuals with an intuitive and comfortable vehicular environment. The present disclosure builds on integrating existing technology with new devices, methods, and systems to provide a complete vehicle ecosystem.

Abstract: Supply chain management that provides end-to-end supply chain visibility to a supply chain manager. The supply chain management may include aggregation of supply chain snapshot data and supply chain flow data to provide improved end-to-end supply chain visibility to a supply chain manager. In turn, supply chain managers may have improved ability to capitalize on opportunities and mitigate deficiencies in the supply chain to improve revenue and provide increased customer satisfaction and more efficient logistics in the supply chain.

Abstract: A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations.

Abstract: Methods of backdrilling printed circuit boards (PCBs) to remove via stubs and related apparatuses. The method may include removing a via stub through a combination of backdrilling and chemical etching. The backdrilling may remove a masking layer from the via stub. Portions of an underlying layer may remain in the region of the via stub after the backdrilling is completed. The remaining portions of the underlying layer may be removed in a subsequent etching process thereby removing the via stub from the PCB. As the backdrilling step may be used for the limited purpose of removing the outer layer and portions of the underlying layer remaining in the via can be tolerated, the diameter of the backdrilling need not be as large as traditional backdrilling where all layers within the via must be ensured of being completely removed.