Abstract: A platform for converting a signal between optical and electrical form and vice versa is provided. The platform includes a dielectric mount, a semiconductor light source and optical fibers. Some of these components are fabricated separately and then brought together in an integrated assembly together with a focusing lens. The platform permits the self-alignment of the optical fibers in a flip-chip vertical cavity surface emitting laser (VCSEL) array module package. The self-alignment of the optical fibers is achieved by the engineering of the geometrical dimensions of the platform. The techniques may be used to form large-scale integrated opto-electronic circuits and switching networks.

Abstract: An optical assembly is provided that is capable of high speed operation using a vertical cavity laser such as a vertical cavity surface emitting laser (VCSEL). The optical assembly is configured to have a small form factor and uses an angled surface of an embedded fiber to internally reflect a beam from the VCSEL along the length of the fiber. The angled surface is coated to ensure that a small portion of the beam is transmitted through the fiber out of the angled surface into a monitoring diode. This geometry provides high coupling efficiency and facilitates direct active alignment between the fiber and the VCSEL.

Abstract: An optical assembly is provided that is capable of high speed operation using a vertical cavity laser such as a vertical cavity surface emitting laser (VCSEL). The optical assembly is configured to have a small form factor and uses an angled surface of an embedded fiber to internally reflect a beam from the VCSEL along the length of the fiber. The angled surface is coated to ensure that a small portion of the beam is transmitted through the fiber out of the angled surface into a monitoring diode. This geometry provides high coupling efficiency and facilitates direct active alignment between the fiber and the VCSEL.

Abstract: A platform for converting a signal between optical and electrical form and vice versa is provided. The platform includes a dielectric mount, a semiconductor light source and optical fibers. Some of these components are fabricated separately and then brought together in an integrated assembly together with a focusing lens. The platform permits the self-alignment of the optical fibers in a flip-chip vertical cavity surface emitting laser (VCSEL) array module package. The self-alignment of the optical fibers is achieved by the engineering of the geometrical dimensions of the platform. The techniques may be used to form large-scale integrated opto-electronic circuits and switching networks.