Abstract: An apparatus for electrically testing a semiconductor device comprises a probe card comprising a probe, wherein the probe comprises a probe tip. Further, the probe tip comprises a foot with an arbitrarily sized cross-section and an apex with an arbitrarily sized cross-section, wherein the cross-section of the foot is wider than the cross-section of the apex.

Abstract: A pressure sensor comprises an upper wafer formed from a dielectric material, the upper wafer having one or more channels. The upper wafer includes a first capacitor plate and a second capacitor plate formed on a lower surface of the upper wafer. According to one embodiment the sensor further comprises an inductor formed from one or more windings of a conductive material, the inductor being contained within the one or more channels in the upper wafer in fixed relation to the first and second capacitor plates, the inductor comprising first and second inductor leads, the first lead being electrically coupled to the first capacitor plate and the second lead electrically coupled to the second capacitor plate.

Abstract: A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.

Abstract: The method for forming a semiconductor probe tip comprises depositing a first copper layer onto exposed electrically conductive areas of a wafer. The first copper layer surrounds a non-conductive polymer structure on the wafer. The non-conductive polymer structure is removed to form a primary cavity in the first copper layer. The wafer and the primary cavity are coated with a polymer layer. Regions of the polymer layer are removed to form a secondary cavity within and alongside the primary cavity. A metal layer is deposited on exposed electrically conductive areas of the wafer and within bounds of the secondary cavity.

Abstract: An apparatus for electrically testing a semiconductor device is disclosed. The apparatus comprises a probe card comprising a probe, wherein the probe comprises a probe tip. Further, the probe tip comprises a foot with an arbitrarily sized cross-section and an apex with an arbitrarily sized cross-section, wherein the cross-section of the foot is wider than the cross-section of the apex.

Abstract: Wireless sensors configured to sense, record and transmit data are provided herein. In one aspect, the wireless sensor has a power harvesting unit; a transducing A-to-D converter unit, a microcontroller unit, and a transmitting coil. The power harvesting unit is configured to receive an external energizing magnetic field generated by an external interrogator and store the energy generated thereby. The transducing A-to-D converter unit has a passive electrical transducer configured to respond to variations in a physical property and a converter configured to measure a characteristic value of the passive electrical transducer and provide a digital signal that is indicative of the measured characteristic value. The microcontroller unit is electrically coupled to the power harvesting unit and the transducing A-to-D converter unit and is configured to receive the digital signal from the transducing A-to-D converter unit.

Abstract: A method for testing a semiconductor device. The method comprises moving a probe in a vertical direction towards an electrical structure on a semiconductor device to position the probe alongside the electrical structure. A tip of the probe is positioned lower than an elevation of an outermost periphery of the electrical structure. The method also includes moving the probe in a lateral direction towards the electrical structure to contact the electrical structure. The probe tip mechanically and electrically engages the electrical structure.

Abstract: A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.

Abstract: An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; wherein each probe is capable of elastic deformation when the probe tip comes in contact with the electronic devices; each probe comprising a plurality of isolated electrical vertical interconnect accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

Abstract: Wireless sensors configured to sense, record and transmit data are provided herein. In one aspect, the wireless sensor has a power harvesting unit; a transducing A-to-D converter unit, a microcontroller unit, and a transmitting coil. The power harvesting unit is configured to receive an external energizing magnetic field generated by an external interrogator and store the energy generated thereby. The transducing A-to-D converter unit has a passive electrical transducer configured to respond to variations in a physical property and a converter configured to measure a characteristic value of the passive electrical transducer and provide a digital signal that is indicative of the measured characteristic value. The microcontroller unit is electrically coupled to the power harvesting unit and the transducing A-to-D converter unit and is configured to receive the digital signal from the transducing A-to-D converter unit.

Abstract: A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.

Abstract: Wireless sensors configured to record and transmit data as well as sense and, optionally, actuate to monitor physical properties of an environment and, optionally, effect changes within that environment. In one aspect, the wireless sensor can have a power harvesting unit; a voltage regulation unit, a transducing oscillator unit, and a transmitting coil. The voltage regulation unit is electrically coupled to the power harvesting unit and is configured to actuate at a minimum voltage level. The transducing oscillator unit is electrically coupled to the voltage regulation unit and is configured to convert a sensed physical property into an electrical signal. Also, the transmitting coil is configured to receive the electrical signal and to transmit the electrical signal to an external antenna.

Abstract: An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

Abstract: Provided are microfabricated probe elements, including elastomer elements, and methods of making the same, that can be readily used with fine pitch microelectronic arrays, for instance by providing sufficient compliance in a small package, while minimizing deflection forces, and while precisely maintaining the planarity and positioning of the contact tips across vast grid arrays. Elastomer elements may be generated using photolithography, either directly or through a sacrificial lost-mold process. Elastomer probe elements are provided with rigid tip structures microfabricated thereon to improve contact pressure. A novel space transformation probe card assembly is also provided.

Abstract: A method for providing an in-vivo assessment of relative movement of an implant that is positioned in a living being is provided wherein a first assembly and a second assembly are positioned within the living being. The first assembly includes a passive electrical resonant circuit that is configured to be selectively electromagnetically coupled to an ex-vivo source of RF energy and, in response to the electromagnetic coupling, generates an output signal characterized by a frequency that is dependent upon a distance between the first assembly and the second assembly at the time of the electromagnetic coupling.

Abstract: A ventricular shunt systems and methods of preventing hydrocephalus are described herein. In one aspect, the ventricular shunt system has at least one pressure sensor that is configured to be selectively electromagnetically coupled to an ex-vivo source of RF energy and is variable in response to the pressure in a patient's ventricle.

Abstract: A ventricular shunt systems and methods of preventing hydrocephalus are described herein. In one aspect, the ventricular shunt system has at least one pressure sensor that is configured to be selectively electromagnetically coupled to an ex-vivo source of RF energy and is variable in response to the pressure in a patient's ventricle.

Abstract: Provided are microfabricated probe elements, including elastomer elements, and methods of making the same, that can be readily used with fine pitch microelectronic arrays, for instance by providing sufficient compliance in a small package, while minimizing deflection forces, and while precisely maintaining the planarity and positioning of the contact tips across vast grid arrays. Elastomer elements may be generated using photolithography, either directly or through a sacrificial lost-mold process. Elastomer probe elements are provided with rigid tip structures microfabricated thereon to improve contact pressure. A novel space transformation probe card assembly is also provided.

Abstract: An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

Abstract: An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.