Patents by Inventor Florent GRECO

Florent GRECO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9908773
    Abstract: A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: March 6, 2018
    Assignees: Commissariat à l'énergie atomique et aux énergies alternatives, EPCOS AG
    Inventors: Damien Saint-Patrice, Arnoldus Den Dekker, Marcel Giesen, Florent Greco, Gudrun Henn, Jean-Louis Pornin, Bruno Reig
  • Publication number: 20160304338
    Abstract: A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.
    Type: Application
    Filed: December 6, 2013
    Publication date: October 20, 2016
    Applicants: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, EPCOS AG
    Inventors: Damiel SAINT-PATRICE, Arnoldus DEN DEKKER, Marcel GIESEN, Florent GRECO, Gudrun HENN, Jean-Louis PORNIN, Bruno REIG
  • Patent number: 9199839
    Abstract: Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of wettable material and on a second part of said surface located around the portion of wettable material; reflowing the portion of fuse material to form a bump of fuse material which has a shape corresponding to a part of a sphere, which is fastened only to the portion of wettable material and which hermetically plugs the hole; wherein the hole is made in said surface before reflowing the portion of fuse material.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: December 1, 2015
    Assignees: Commissariat à l'énergie atomique et aux énergies alternatives, EPCOS AG
    Inventors: Jean-Louis Pornin, Arnoldus Den Dekker, Marcel Giesen, Florent Greco, Gudrun Henn, Bruno Reig, Damien Saint-Patrice
  • Publication number: 20150158725
    Abstract: Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of wettable material and on a second part of said surface located around the portion of wettable material; reflowing the portion of fuse material to form a bump of fuse material which has a shape corresponding to a part of a sphere, which is fastened only to the portion of wettable material and which hermetically plugs the hole; wherein the hole is made in said surface before reflowing the portion of fuse material.
    Type: Application
    Filed: November 24, 2014
    Publication date: June 11, 2015
    Applicants: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT, EPCOS AG
    Inventors: Jean-Louis PORNIN, Arnold DEN DEKKER, Marcel GIESEN, Florent GRECO, Gudrun HENN, Bruno REIG, Damien SAINT-PATRICE