Abstract: A control device and method for a vehicle having an automatically opening and/or automatically closing flap includes an operating switch which can be operated contactlessly in the form of a proximity sensor and a programmable functional module. The method includes the following steps: firstly, an operating requirement signal is generated upon recognition of a predetermined proximity pattern consisting of the raw sensor signal of the proximity sensor for output of a resulting control signal to an unlocking and locking mechanism for the actual automatic opening or closing the valve, secondly, it is determined whether a predetermined absolute limit value of the raw sensor signal is exceeded, and thirdly, when the predetermined limiting value is exceeded, the output of the control signal is also suppressed when the operating requirement signal is generated, wherein this provision is also designated in short below as “suppression mode”.

Abstract: A control device and method for a vehicle having an automatically opening and/or automatically closing flap includes an operating switch which can be operated contactlessly in the form of a proximity sensor and a programmable functional module. The method includes the following steps: firstly, an operating requirement signal is generated upon recognition of a predetermined proximity pattern consisting of the raw sensor signal of the proximity sensor for output of a resulting control signal to an unlocking and locking mechanism for the actual automatic opening or closing the valve, secondly, it is determined whether a predetermined absolute limit value of the raw sensor signal is exceeded, and thirdly, when the predetermined limiting value is exceeded, the output of the control signal is also suppressed when the operating requirement signal is generated, wherein this provision is also designated in short below as “suppression mode”.

Abstract: A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 kgf, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.

Abstract: A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.

Abstract: An integrated device is disclosed. In one embodiment, the integrated device includes a carrier substrate with a through hole and a contact sleeve. A circuit chip is provided with a contact pad above the carrier substrate. A conductive material electrically connects the contact pad to the contact sleeve.

Abstract: A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.

Abstract: Provided is a semiconductor package, and a method for constructing the same, including a first substrate, a first semiconductor chip attached to the first substrate, and a first copper wire. At least one of the first substrate and the first semiconductor chip has an Organic Solderability Preservative (OSP) material coated on at least a portion of one surface, and the first copper wire is wire bonded through the OSP material to the first substrate and the first semiconductor chip.

Abstract: An integrated device is disclosed. In one embodiment, the integrated device includes a carrier substrate with a through hole and a contact sleeve. A circuit chip is provided with a contact pad above the carrier substrate. A conductive material electrically connects the contact pad to the contact sleeve.