Abstract: A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein the lead frame has two connection parts for external electrical contacting of the device; the moulded body is formed to the lead frame; the moulded body is transmissive to the radiation generated during operation of the device; and the semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device. Furthermore, a method for producing devices is specified.

Abstract: A device includes a carrier and a plurality of semiconductor chips configured to generate radiation. The carrier includes a lead frame. The lead frame includes two connecting parts for external electrical contacting of the device. The semiconductor chips are arranged on the carrier. The carrier is surrounded by a casing at least in places along its entire circumference. The casing forms a side face of the device at least in places. The side face includes traces of material removal.

Abstract: A light-emitting device includes a multiplicity of light-emitting modules arranged on a first substrate. Each light-emitting module of the multiplicity of light-emitting modules includes a multiplicity of light-emitting components arranged on a second substrate. The second substrate is electrically connected to the first substrate, and includes a common primary lens for the multiplicity of light-emitting components.

Abstract: A light emitting filament device comprising a carrier extending in a longitudinal direction and having a first main surface, a second main surface opposite to the first main surface, and two side surfaces interconnecting the two main surfaces. Optoelectronic components are disposed on the first main surface of the carrier. A first converter layer is arranged on the first main surface of the carrier and covers the optoelectronic components. A second converter layer is arranged on the second main surface of the carrier. The carrier is designed at at least one location along the longitudinal direction such that at least one of the two side surfaces includes an angle with the first main surface of greater than 90°. The carrier is trapezoidal in cross-section at the at least one location.

Abstract: A light emitting filament device comprising a carrier extending in a longitudinal direction and having a first main surface, a second main surface opposite to the first main surface, and two side surfaces interconnecting the two main surfaces. Optoelectronic components are disposed on the first main surface of the carrier. A first converter layer is arranged on the first main surface of the carrier and covers the optoelectronic components. A second converter layer is arranged on the second main surface of the carrier. The carrier is designed at at least one location along the longitudinal direction such that at least one of the two side surfaces includes an angle with the first main surface of greater than 90°. The carrier is trapezoidal in cross-section at the at least one location.

Abstract: An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.

Abstract: A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein the lead frame has two connection parts for external electrical contacting of the device; the moulded body is formed to the lead frame; the moulded body is transmissive to the radiation generated during operation of the device; and the semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device. Furthermore, a method for producing devices is specified.

Abstract: A device with semiconductor chips on a primary carrier is disclosed. In an embodiment a device includes a primary carrier, a plurality of semiconductor chips arranged on the primary carrier, a radiation conversion material arranged at least in places on the semiconductor chips and the primary carrier, a secondary carrier to which the primary carrier is attached and a scattering body arranged on a front side of the secondary carrier facing the primary carrier, the scattering body covering the semiconductor chips, wherein the primary carrier is formed reflective to primary radiation at least in a region of the semiconductor chips, and wherein, during operation of the device, at least secondary radiation exits through a front side of the scattering body facing away from the secondary carrier and through a rear side of the secondary carrier facing away from the primary carrier.

Abstract: A luminous means is disclosed, the luminous means having LEDs on a substrate, an outer bulb in which the substrate having the LEDs is arranged, and a cap, wherein at least two partial surfaces of the substrate are folded out with respect to the remaining substrate around a bridge area in each case, via which the particular partial surface is connected to the remaining substrate, and are thus set obliquely with respect to the remaining substrate which is flat per se, wherein, for each side surface of the remaining substrate, which side surfaces are opposite one another with respect to a thickness direction of the remaining substrate, at least one partial surface is folded out in each case, and wherein at least one of the LEDs is arranged on each of the partial surfaces.

Abstract: The present invention relates to a luminous means comprising an enveloping bulb, a base, a first LED and a second LED, which are assembled on a planar printed circuit board, to be precise on the opposite side thereof in relation to a thickness direction, wherein a first diverging lens is mounted on the first side of the printed circuit board in a manner assigned to the first LED and a second diverging lens is mounted on the second side of the printed circuit board in a manner assigned to the second LED for the purposes of homogenizing the light distribution generated by the luminous means, and the light emitted by the respective LED has a widened luminous intensity distribution downstream of the respective diverging lens in comparison with upstream of the respective diverging lens.

Abstract: Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.

Abstract: A device with semiconductor chips on a primary carrier is disclosed. In an embodiment a device includes a primary carrier, a plurality of semiconductor chips arranged on the primary carrier, a radiation conversion material arranged at least in places on the semiconductor chips and the primary carrier, a secondary carrier to which the primary carrier is attached and a scattering body arranged on a front side of the secondary carrier facing the primary carrier, the scattering body covering the semiconductor chips, wherein the primary carrier is formed reflective to primary radiation at least in a region of the semiconductor chips, and wherein, during operation of the device, at least secondary radiation exits through a front side of the scattering body facing away from the secondary carrier and through a rear side of the secondary carrier facing away from the primary carrier.

Abstract: An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.

Abstract: The present invention relates to a luminous means (1) comprising an enveloping bulb (3), a base (4), a first LED (21a) and a second LED (21b), which are assembled on a planar printed circuit board (2), to be precise on the opposite sides (20) thereof in relation to a thickness direction, wherein a first diverging lens (5a) is mounted on the first side (20a) of the printed circuit board (2) in a manner assigned to the first LED (21a) and a second diverging lens (5b) is mounted on the second side (20b) of the printed circuit board (2) in a manner assigned to the second LED (21b) for the purposes of homogenizing the light distribution generated by the luminous means (1), and the light emitted by the respective LED (21) has a widened luminous intensity distribution downstream of the respective diverging lens (5) in comparison with upstream of the respective diverging lens (5).

Abstract: The present invention relates to a luminous means (1) having LEDs (23) on a substrate (2), an outer bulb (3) in which the substrate (2) having the LEDs (23) is arranged, and a cap (4), wherein at least two partial surfaces (2a) of the substrate (2) are folded out with respect to the remaining substrate (2b) around a bridge area (25) in each case, via which the particular partial surface (2a) is connected to the remaining substrate (2b), and are thus set obliquely with respect to the remaining substrate (2b) which is flat per se, wherein, for each side surface of the remaining substrate (2b), which side surfaces are opposite one another with respect to a thickness direction of the remaining substrate (2b), at least one partial surface (2a) is folded out in each case, and wherein at least one of the LEDs (23) is arranged on each of the partial surfaces (2a).

Abstract: Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.

Abstract: Various embodiments relate to a lighting device with an optoelectronic light source, an optical body downstream thereof for distributing the light, and a diffuser downstream of the latter, onto the light entry surface of which the light emitted by the optical body falls and the light exit surface of which represents a light emission surface of the lighting device. To homogenize the luminous intensity on the light exit surface, in addition to distributing the light with the optical body, the diffuser is not provided to be uniformly scattering to such an extent that light falling thereon in a central region is scattered more intensely than light falling thereon in an edge region.

Abstract: Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.

Abstract: In various embodiments, a lighting unit is provided. The lighting unit may include a hollow body made of a plastics material as a substrate, which hollow body has an outer surface and an opposite inner surface, wherein the latter at least partially delimits a hollow body internal volume, a plurality of light emitting diodes, which are arranged on the outer surface of the hollow body, and a conductor track structure, which is electrically conductively connected to the light emitting diodes. The conductor track structure is arranged on the inner surface of the hollow body, and the electrically conductive connection to the light emitting diodes is produced by through-contacts, which are passed through the plastics material.

Abstract: In various embodiments, a lighting device includes at least one laser light source and a light wavelength conversion element. The light wavelength conversion element includes phosphor which is arranged on a surface region of a substrate and is used for wavelength conversion of the light emitted by the at least one laser light source. The light wavelength conversion element has a greater thickness at the edge of the surface region, provided with phosphor, of the substrate than at the surface centroid of the surface region, provided with phosphor, of the substrate. The thickness is respectively measured perpendicularly to the surface region, provided with phosphor, of the substrate.