Abstract: A method includes: applying a pre-layer to a first or second connection partner; arranging the first connection partner on the second connection partner with the pre-layer arranged therebetween; heating the connection partners with the pre-layer arranged therebetween; and while heating, exerting pressure on the first connection partner such that the first connection partner is pressed towards the second connection partner and a permanent connection layer is formed between the connection partners. A first pressure exerted on at least one first section of the first connection partner is less than a second pressure exerted on at least one second section of the first connection partner. The resulting permanent connection layer has a higher porosity in areas arranged below the at least one first section of the first connection partner and a lower porosity in areas arranged below the at least one second section of the first connection partner.

Abstract: A semiconductor package includes: a molded body having opposite first and second sides; at least one semiconductor die encapsulated by the molded body; and a die carrier having opposite first and second sides. The semiconductor die is arranged over the first side of the die carrier. The second side of the die carrier is at least partially exposed from the second side of the molded body, forming at least one exposed portion of the die carrier. The first side of the molded body includes a first portion protruding from a second portion in a vertical direction perpendicular to the first side, forming a planar surface. The second portion extends completely along at least one edge of the first side. A center point of the first portion is in vertical alignment with a center point of the exposed portion.

Abstract: A unit for high-temperature for uses above 700° C. is provided. The unit includes a housing and an electrical functional element. The functional element has a non-conducting substrate, an electrically conductive element, and at least one connection wire or pad. The functional element has a first section, a second section, and a third section. The first section is within the housing and shielded from a local environment. The second section includes the at least one connection wire or pad and is accessible externally to the housing. The third section is between the first and second sections and is embedded in an electrically insulating material. The insulating material seals off the housing from the functional element. A physical and/or chemical bond at an interface between the insulating material and the functional element.

Abstract: An electrical feedthrough assembly is disclosed having a base body with at least one opening for a conductor embedded in a fixation material that is fed into each of the respective openings and sealing the respective opening. The electrical feedthrough assembly further includes an insulation element made from a material having a first glass-transition temperature tg1, wherein the insulation element is affixed by an adhesive material arranged between the insulation element and the fixation material.

Abstract: The present invention refers to a process for direct C—H functionalization, the reagents used in the process and the use thereof for the direct C—H functionalization as well as the so-obtained products.

Abstract: The invention relates to a pneumatic utility vehicle tire of a radial type of construction, in particular for trucks, buses, and truck trailers, which has a four-ply or multi-ply belt (4) comprising a barrier ply (5), two working plies (6, 8) and a 0° ply (7), wherein steel cords (10) are arranged in the 0° ply (7), comprising at least two strands (11) each with at least 6 steel filaments (12), and wherein twisting causes each strand to have an identical first twist angle ? and the steel cord to have a second twist angle ?. The invention is distinguished in that the steel cord (10) of the 0° ply (7) has the construction 2 to 4×n×d, with n=6 to 8 and with d=0.15 mm to 0.

Abstract: The present invention refers to a process for direct C—H functionalization, the reagents used in the process and the use thereof for the direct C—H functionalization as well as the so-obtained products.

Abstract: A pneumatic vehicle tire of radial type of construction for utility vehicles, in particular trucks, buses and truck trailers, having a belt which has three or more belt plies (5, 6, 7, 8, 9) with steel cords (10), wherein each steel cord (10) has at least two strands (11) and wherein each strand (11) has at least two steel filaments (12); the invention is characterized in that steel cords (10) of the construction 2 to 4×N, where N=2 to 5, are at least arranged in one of the belt plies (5, 6, 7, 8, 9), wherein this construction means that this steel cord (10) has 2 to 4 twisted-together strands (11), wherein each strand (10) comprises 2 to 5 steel filaments (12) which are twisted together such that these 2 to 5 steel filaments (12) are arranged without a core filament.

Abstract: The present invention refers to a process for direct C—H functionalization, the reagents used in the process and the use thereof for the direct C—H functionalization as well as the so-obtained products.

Abstract: A unit for high-temperature for uses above 700° C. is provided. The unit includes a housing and an electrical functional element. The functional element has a non-conducting substrate, an electrically conductive element, and at least one connection wire or pad. The functional element has a first section, a second section, and a third section. The first section is within the housing and shielded from a local environment. The second section includes the at least one connection wire or pad and is accessible externally to the housing. The third section is between the first and second sections and is embedded in an electrically insulating material. The insulating material seals off the housing from the functional element. A physical and/or chemical bond at an interface between the insulating material and the functional element.

Abstract: The present invention refers to a process for direct C—H functionalization, the reagents used in the process and the use thereof for the direct C—H functionalization as well as the so-obtained products.