Patents by Inventor Florian BERNSTEINER

Florian BERNSTEINER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for structuring a substrate using a protection layer as a mask
    Patent number: 9793119
    Abstract: According to various embodiments, a method of processing a substrate may include: disposing a viscous material over a substrate including at least one topography feature extending into the substrate to form a protection layer over the substrate; adjusting a viscosity of the viscous material during a contacting period of the viscous material and the substrate to stabilize a spatial distribution of the viscous material as disposed; processing the substrate using the protection layer as mask; and removing the protection layer after processing the substrate.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: October 17, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Martin Mischitz, Markus Heinrici, Florian Bernsteiner
  • Method for structuring a substrate
    Patent number: 9768023
    Abstract: According to various embodiments, a method of processing a substrate may include: disposing a viscous material over a substrate including at least one topography feature extending into the substrate to form a protection layer over the substrate; adjusting a viscosity of the viscous material during a contacting period of the viscous material and the substrate to stabilize a spatial distribution of the viscous material as disposed; processing the substrate using the protection layer as mask; and removing the protection layer after processing the substrate.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: September 19, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Martin Mischitz, Markus Heinrici, Florian Bernsteiner
  • METHOD FOR STRUCTURING A SUBSTRATE
    Publication number: 20170154767
    Abstract: According to various embodiments, a method of processing a substrate may include: disposing a viscous material over a substrate including at least one topography feature extending into the substrate to form a protection layer over the substrate; adjusting a viscosity of the viscous material during a contacting period of the viscous material and the substrate to stabilize a spatial distribution of the viscous material as disposed; processing the substrate using the protection layer as mask; and removing the protection layer after processing the substrate.
    Type: Application
    Filed: November 10, 2016
    Publication date: June 1, 2017
    Inventors: Martin MISCHITZ, Markus HEINRICI, Florian BERNSTEINER