Abstract: An exchangeable electronics assembly of a motor vehicle. The assembly includes at least one circuit board with at least one electronics component to be cooled arranged on the circuit board, at least one plug oriented in parallel to an insertion direction of the electronics assembly into a housing accommodating a plurality of electronics assemblies, at least one housing connected to the circuit board and at least partially surrounding the circuit board, at least one insertion mechanism that cooperates with at least one receptacle of the housing accommodating a plurality of electronics assemblies, and at least one heat-conducting element in thermal contact with the electronics component, wherein the heat-conducting element includes a contact surface oriented transverse to the insertion direction for thermally linking a cooler, wherein the plug protrudes further than the contact surface in the insertion direction.

Abstract: A device with exchangeable electronics assemblies of a motor vehicle. The device includes a housing to at least partially enclose the electronics assemblies exchangeable in an insertion direction, an insertion mechanism for receiving the exchangeable electronics assemblies, a front side which is at least partially detachably connected to the housing and via which access to the exchangeable electronics assemblies arranged inside the housing is possible. A rear housing cover and a circuit board which is aligned transversely to an insertion direction of the electronics assemblies and serves to contact the exchangeable electronics assemblies are provided.

Abstract: A plug-in module. The plug-in module includes a module housing, a heat-dissipating device, and an electrical component arranged on a printed circuit board. The heat-dissipating device has, on a surface facing the electrical component, an internal thermal interface to thermally couple the electrical component to the heat-dissipating device. The heat-dissipating device has, on a surface facing away from the electrical component, an external thermal interface to thermally couple at least one heat-dissipating device to an external heat sink. The external thermal interface includes a thermally conductive elastic compensating element connected to the heat-dissipating device and designed to be compressed during formation of the external thermal interface.

Abstract: The present invention relates to methods for predicting the response of a breast cancer patient to a chemotherapy. The present invention further relates to a method of determining whether to treat a breast cancer patient with a chemotherapy. The present invention also relates to a kit for predicting the response of a breast cancer patient to a chemotherapy.