Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.

Abstract: The disclosure relates to a system, comprising a first circuit board comprising a control circuitry configured to control a beamforming array of microphones, and multiple second circuit boards attached to the first circuit board, each one of the multiple second circuit boards mounting a microphone of the array of microphones.

Abstract: A microphone arrangement comprises a microphone array comprising at least two microphones, each of the at least two microphones providing a microphone output signal, a first adder, configured to provide a microphone array output signal by summing delayed versions of the microphone output signals of each of the at least two microphones, a first filter unit, configured to provide a filtered microphone array output signal, a second filter unit configured to provide a filtered microphone output signal of one of the at least two microphones, and a second adder, configured to provide an output microphone signal by summing the filtered microphone array output signal and the filtered microphone output signal.

Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.

Abstract: In at least one embodiment, a sound and vibration sensor is provided. The sound and vibration sensor includes a housing, a piezo-diaphragm, and a flexible support plate. The piezo-diaphragm is positioned in the housing to detect an input signal including audio or vibrations. The flexible support plate receives the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal.

Abstract: In at least one embodiment, a sound and vibration sensor is provided. The sound and vibration sensor includes a housing, a piezo-diaphragm, and a flexible support plate. The piezo-diaphragm is positioned in the housing to detect an input signal including audio or vibrations. The flexible support plate receives the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal.

Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.

Abstract: The disclosure relates to a system, comprising a first circuit board comprising a control circuitry configured to control a beamforming array of microphones, and multiple second circuit boards attached to the first circuit board, each one of the multiple second circuit boards mounting a microphone of the array of microphones.

Abstract: A microphone arrangement includes a carrier structure having a rear surface, a front surface and a through-hole between the rear surface and the front surface, and a microphone having an enclosure, the enclosure comprising a rear section that fits into the through-hole and a front section that seats on the front surface of the carrier structure around the through-hole, the front section of the microphone enclosure has a front surface and a rear surface. A microphone cover layer covers the front surface of the front section of the microphone enclosure.

Abstract: A microphone assembly includes a printed circuit board that defines a tab that is configured to extend into an opening defined by a substrate layer of a headliner. The microphone assembly includes a microphone element mounted on the tab. The microphone assembly includes a sealing element that surrounds the tab and the microphone element and is configured to fill the opening and define an air path from a cabin side of the substrate layer to the printed circuit board or the microphone element.

Abstract: A microphone assembly includes a printed circuit board that defines a tab that is configured to extend into an opening defined by a substrate layer of a headliner. The microphone assembly includes a microphone element mounted on the tab. The microphone assembly includes a sealing element that surrounds the tab and the microphone element and is configured to fill the opening and define an air path from a cabin side of the substrate layer to the printed circuit board or the microphone element.