Patents by Inventor Florian Eacock

Florian Eacock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200043883
    Abstract: A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping.
    Type: Application
    Filed: July 31, 2019
    Publication date: February 6, 2020
    Inventors: Florian Eacock, Michal Chajneta, Stefan Tophinke
  • Publication number: 20190356098
    Abstract: One aspect relates to a method that includes bonding an electrically conductive element to a bonding surface of a bonding partner by increasing a temperature of a bonding section of the electrically conductive element from an initial temperature to an increased temperature by passing an electric heating current through the bonding section, and pressing the bonding section with a pressing force against the bonding surface using a sonotrode and introducing an ultrasonic vibration into the bonding section via the sonotrode such that the increased temperature of the bonding section, the ultrasonic signal in the bonding section and the pressing force are simultaneously present and cause the formation of a tight and direct bond between the bonding section and the bonding surface.
    Type: Application
    Filed: May 14, 2019
    Publication date: November 21, 2019
    Inventors: Florian Eacock, Guido Strotmann, Alparslan Takkac
  • Publication number: 20190312008
    Abstract: A method comprises heating a first electrically conductive layer that is to be electrically contacted, and that is arranged on a first element, and pressing a first end of a bonding wire on the first electrically conductive layer by exerting pressure to the first end of the bonding wire, and further by exposing the first end of the bonding wire to ultrasonic energy, thereby deforming the first end of the bonding wire and creating a permanent substance-to-substance bond between the first end of the bonding wire and the first electrically conductive layer. The bonding wire either comprises a rounded cross section with a diameter of at least 125 ?m or a rectangular cross section with a first width of at least 500 ?m and a first height of at least 50 ?m.
    Type: Application
    Filed: April 3, 2019
    Publication date: October 10, 2019
    Inventors: Florian Eacock, Marian Sebastian Broll, Stefan Tophinke