Patents by Inventor Florian JACOB

Florian JACOB has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230179069
    Abstract: An electric motor with a housing, at least two terminal contacts and at least one suppression device against electromagnetic emissions, wherein the suppression device comprises at least one circuit carrier with at least one filter circuit, wherein the circuit carrier is arranged on an end side of the electric motor, and wherein the filter circuit is electrically connected to the two terminal contacts. The manufacturing effort is reduced in that at least one contact means electrically connected to the filter circuit is attached to the circuit carrier, and in that the contact means bears against a ground contact with at least partial deformation, so that the filter circuit is electrically connected to the ground contact via the contact means.
    Type: Application
    Filed: December 5, 2022
    Publication date: June 8, 2023
    Applicant: DR. FRITZ FAULHABER GMBH & CO. KG
    Inventors: Florian JACOBS, Thomas SCHNEIDER
  • Patent number: 11139965
    Abstract: The invention relates to a building or enclosure termination opening and/or closing apparatus (10) having communication signed or encrypted by means of a key, and to a method for operating such. To allow simple, convenient and secure use by exclusively authorised users, the apparatus comprises: a first and a second user terminal (14, 30), with secure forwarding of a time-limited key from the first to the second user terminal being possible. According to an alternative, individual keys are generated by a user identification (42) and a secret device key (40).
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: October 5, 2021
    Assignee: Hörmann KG Antriebstechnik
    Inventors: Florian Jacob, Jörg Schmalenströer
  • Publication number: 20200007323
    Abstract: The invention relates to a building or enclosure termination opening and/or closing apparatus (10) having communication signed or encrypted by means of a key, and to a method for operating such. To allow simple, convenient and secure use by exclusively authorised users, the apparatus comprises: a first and a second user terminal (14, 30), with secure forwarding of a time-limited key from the first to the second user terminal being possible. According to an alternative, individual keys are generated by a user identification (42) and a secret device key (40).
    Type: Application
    Filed: October 10, 2017
    Publication date: January 2, 2020
    Applicant: Hörmann KG Antriebstechnik
    Inventors: Florian JACOB, Jörg SCHMALENSTRÖER
  • Patent number: 10206308
    Abstract: The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: February 12, 2019
    Assignee: NERDALIZE B.V.
    Inventors: Mathijs De Meijer, Remy Van Rooijen, Marinus Schoute, Thomas De Jong, Boaz Samuel Leupe, Florian Jacob Schneider
  • Publication number: 20180295745
    Abstract: The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber.
    Type: Application
    Filed: March 16, 2016
    Publication date: October 11, 2018
    Inventors: Mathijs DE MEIJER, Remy VAN ROOIJEN, Marinus SCHOUTE, Thomas DE JONG, Boaz Samuel LEUPE, Florian Jacob SCHNEIDER