Abstract: Embodiments of the present disclosure describe quantum circuit assemblies that include one or more filter modules integrated in a package with a quantum circuit component having at least one qubit device. Integration may be such that both the quantum circuit component and the filter module(s) are at least partially inside a chamber formed by a radiation shield structure that is configured to attenuate electromagnetic radiation incident on the quantum circuit component and the filter module(s). Placing filter modules under the protection provided by the radiation shield structure may boost coherence of the qubits. Some example filter modules may include filter(s) configured to convert electromagnetic radiation to heat and filter(s) configured to perform bandpass filtering. Modular blocks of in-line filters inside the shielded environment may allow to route signals to the quantum circuit component with reduced noise and speed up installation of a complete quantum computer.

Abstract: Technologies for radiofrequency optimized interconnects for a quantum processor are disclosed. In the illustrative embodiment, signals are carried in coplanar waveguides on a surface of a quantum processor die. A ground ring surrounds the signals and is connected to the ground conductors of each coplanar waveguide. Wire bonds connect the ground ring to a ground of a circuit board. The wire bonds provide both an electrical connection from the quantum processor die to the circuit board as well as increased thermal coupling between the quantum processor die and the circuit board, increasing cooling of the quantum processor die.