Patents by Inventor Florian Obermayer

Florian Obermayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optoelectronic component using two encapsulating materials and the method of making the same
    Patent number: 6861683
    Abstract: In an optoelectronic component assembly and a method for the production thereof, the optoelectronic component assembly includes an optoelectronic component arranged on a support element, which is surrounded by a closed dam. An encapsulation is arranged in an inner area of the dam, which encapsulates the optoelectronic component and includes two sealing materials. The inner area of the dam may be filled with a first sealing material up to the top edge of the optoelectronic component. The inner area of the dam located above the optoelectronic component is filled with a second transparent sealing material at least in one area of the window.
    Type: Grant
    Filed: March 30, 2002
    Date of Patent: March 1, 2005
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventors: Lutz Rissing, Florian Obermayer, Florian Schroll
  • Component assembly and method for producing the same
    Patent number: 6815263
    Abstract: In a component assembly and method for producing the same, the component assembly includes at least one component arranged on a support subframe, e.g., a printed circuit board. An insulator enclosing the component and including two isolating superimposed layers is also arranged on the support substrate. A sealing mass covering the component is arranged inside the insulator. The two or more isolating layers are made from the same isolating material and connected at the contact area.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: November 9, 2004
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventors: Lutz Rissing, Florian Obermayer
  • Optoelectronic component array and method for the production of an optoelectronic component array
    Publication number: 20040150064
    Abstract: The invention relates to an optoelectronic component array and to a method for the production thereof. The optoelectronic component array comprises an optoelectronic component arranged on a support element, which is surrounded by a closed dam. An encapsulation is arranged in the inner area of the dam which encapsulates the optoelectronic component and consists of two scaling materials. The inner area of the dam is preferably filled with a first scaling material up to the top edge of the optoelectronic component. The inner area of the dam located above the optoelectronic component is filled with a second transparent scaling material at least in one area of the window.
    Type: Application
    Filed: October 14, 2003
    Publication date: August 5, 2004
    Inventors: Lutz Rissling, Florian Obermayer, Florian Schroll
  • Component assembly and method for producing the same
    Publication number: 20030173655
    Abstract: The invention relates to a component assembly and a method for producing the same. The component assembly comprises at least one component arranged on a support substrate, for example a printed circuit board. An insulator enclosing the component and comprising two isolating superimposed layers is also arranged on the support substrate. A scaling mass covering the component is arranged inside said insulator. The two or more isolating layers are made from the same isolating material and connected at the contact area.
    Type: Application
    Filed: November 15, 2002
    Publication date: September 18, 2003
    Inventors: Lutz Rissing, Florian Obermayer