Patents by Inventor Florian Rak

Florian Rak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A CAP SUBSTRATE COMPRISING AN INDUCTOR
    Publication number: 20230101228
    Abstract: A package that includes an acoustic device, a frame coupled to the acoustic device and a cap substrate coupled to the acoustic device through the frame. The acoustic device includes a substrate and an acoustic element coupled to the substrate. The cap substrate includes an inductor. The cap substrate is configured as a cap for the acoustic device. The package includes a cavity located between the acoustic device and the cap substrate. The frame may include a polymer frame.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Sebastian BRUNNER, Peter HAGN, Stefan Leopold HATZL, Manuel HOFER, Horst Uwe FAULHABER, Kurt WIESBAUER, Florian RAK, Roman KRAVCHENKO
  • PACKAGE COMPRISING A SUBSTRATE THAT INCLUDES A STRESS BUFFER LAYER
    Publication number: 20210249361
    Abstract: A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, a buffer dielectric layer coupled to the at least one dielectric layer, and a buffer interconnect located at least in the buffer dielectric layer.
    Type: Application
    Filed: February 12, 2020
    Publication date: August 12, 2021
    Inventors: Sebastian BRUNNER, Kurt WIESBAUER, Horst Uwe FAULHABER, Florian RAK, Andreas HAAS, Franz TINAUER, Stefan LEITINGER, Gerhard FUCHS
  • Package comprising a substrate that includes a stress buffer layer
    Patent number: 11088090
    Abstract: A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, a buffer dielectric layer coupled to the at least one dielectric layer, and a buffer interconnect located at least in the buffer dielectric layer.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: August 10, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Sebastian Brunner, Kurt Wiesbauer, Horst Uwe Faulhaber, Florian Rak, Andreas Haas, Franz Tinauer, Stefan Leitinger, Gerhard Fuchs