Patents by Inventor Florian Schattenmann

Florian Schattenmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronics package and associated method
    Publication number: 20070284758
    Abstract: An electronics package is provided. The electronics package may include an underfill layer having a surface that defines an opening. The electronics package may include a polymer bump structure disposed within the opening. A laminate for use as an underfill layer is provided. Associated methods are provided.
    Type: Application
    Filed: May 22, 2006
    Publication date: December 13, 2007
    Applicant: General Electric Company
    Inventors: Jian Zhang, Davide Simone, Christopher Carter, Laura Meyer, Charles Becker, Florian Schattenmann, Sandeep Tonapi, Slawomir Rubinsztajn, Christopher Keimel
  • Curable composition, underfill, and method
    Publication number: 20060147719
    Abstract: A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.
    Type: Application
    Filed: March 3, 2006
    Publication date: July 6, 2006
    Inventors: Slawomir Rubinsztajn, John Campbell, Ryan Mills, Ananth Prabhakumar, Sandeep Tanopi, David Gibson, Florian Schattenmann
  • Thin bond-line silicone adhesive composition and method for preparing the same
    Publication number: 20050148721
    Abstract: Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
    Type: Application
    Filed: February 18, 2005
    Publication date: July 7, 2005
    Inventors: Sandeep Tonapi, Hong Zhong, Florian Schattenmann, Jennifer David, Kimberly Saville, Arun Gowda, David Esler, Ananth Prabhakumar
  • Thin bond-line silicone adhesive composition and method for preparing the same
    Publication number: 20050049350
    Abstract: Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
    Type: Application
    Filed: August 25, 2003
    Publication date: March 3, 2005
    Inventors: Sandeep Tonapi, Hong Zhong, Florian Schattenmann, Jennifer David, Kimberly Saville, Arun Gowda, David Esler, Ananth Prabhakumar
  • Nano-filled composite materials with exceptionally high glass transition temperature
    Publication number: 20050048291
    Abstract: A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica having a particle size in a range between about 2 nanometers and about 20 nanometers, and optional reagents wherein the organofunctionalized colloidal silica substantially increases the glass transition temperature of the epoxy formulation. Further embodiments of the present invention include a semiconductor package comprising the aforementioned curable epoxy formulation.
    Type: Application
    Filed: August 14, 2003
    Publication date: March 3, 2005
    Inventors: Wing Woo, Slawomir Rubinsztajn, John Campbell, Florian Schattenmann, Sandeep Tonapi, Ananth Prabhakumar