Abstract: In order to create a cover for a battery module or for a battery store that comprises a plurality of battery cells, said cover serving not only as contact protection or as protection from the ingress of particles, but also fulfilling the function of a propagation protection by means of which a propagation of a thermal fault from one battery cell of the battery module or the battery store to other battery cells of the battery module or the battery store is able to be prevented or at least delayed, it is proposed that the cover comprises a first layer facing toward the battery cells in the mounted state of the cover and a second layer facing away from the battery cells in the mounted state of the cover, wherein the first layer comprises at least one penetration device, which enables a passage of hot gas from a battery cell through the first layer at a penetration point, and wherein the gas that has passed through the first layer is able to be dissipated from the penetration point in an interspace between the fi

Abstract: A method for changing test substrates in a continuous-flow vacuum system in a multiple-treatment-step process cycle for treating a substrate, a treatment method using the method for changing test substrates, and systems for treating a plurality of substrates (61) and for changing test substrates. For at least two treatment steps, at least two test substrates (66) are transferred to a vacuum treatment system at the beginning of the process cycle and are transferred back out once the process cycle is concluded. Subsequently, the first test substrate (66) concurrently treated in this step is removed from the measurement position (70) it occupied during the treatment and is deposited in an empty position (71) without a test substrate (66). Subsequently, the second test substrate (66) which has not been treated yet is deposited in the resulting free measurement position (70) for the purpose of supplying the second test substrate to the subsequent treatment step.

Abstract: A semiconductor module assembly includes a cooling body having a cooling body main body and a cooling body attachment with a channel structure for a heat-transporting fluid. The channel structure is hermetically sealed with a cooling body main body surface so that the cooling body attachment and the cooling body main body are in direct contact with the heat-transporting fluid. The cooling body attachment includes a central piece having essentially parallel channels of the channel structure, and end pieces arranged on both sides of the central piece. Each end piece has deflection channels of the channel structure, which are arranged to establish a fluidic connection between the essentially parallel channels of the central piece. A semiconductor module contacts the cooling body, with the hermetically sealed channel structure of the cooling body attachment and the heat-transporting fluid forming a pulsating heat pipe which is thermally conductively connected to the semiconductor module.

Abstract: A heat pipe heat sink operating as a pulsating heat pipe includes a body comprising internally a closed channel in which a fluid is arranged such that part of the fluid is present in gaseous form. The channel has a periphery which is designed to be smooth. The body includes a first body portion which is embodied as curved, alternatingly curved, serpentine or U-shaped. A coolant, in particular a gaseous coolant, flows through the first body portion along a surface of the first body portion, wherein portions of the channel are arranged parallel to one another and/or in the presence of more than one channel, different channels are arranged parallel to one another. The body is composed of two block parts, with parts of the channel being arranged on a boundary area of the two block parts, respectively.

Abstract: A device for measuring cell voltages in a module that is composed of a plurality of individual cells inside a rechargeable battery. In order to create a device of the above-mentioned kind with reduced production complexity, the invention proposes measuring devices for voltage measurement via a housing of a respective cell to be electrically connected to a busbar.

Abstract: In a method for producing an apparatus for cooling a semiconductor arrangement, a first cooling channel is produced in a metal body with a first FSC (Friction Stir Channeling) at a first depth from a surface of the metal body. Using the first FSC method, a first connecting channel is produced extending from the first cooling channel to the surface of the metal body. Using second FSC method a second cooling channel is produced in the metal body at a second depth from the surface of the metal body, with the second depth being smaller than the first depth. The first connecting channel forms a fluidic connection between the first cooling channel and the second cooling channel, and the first and second cooling channels and the first connecting channel form a cooling channel structure.

Abstract: A two-phase cooling system for an X-ray high-voltage generator comprises a heat sink block and a heat sink. The heat sink block spatially surrounds a cooling duct loop, wherein the cooling duct loop is at least partially filled with a working medium and is configured to act as an oscillating heat pipe. The heat sink is configured to dissipate heat from a heat source. The heat sink block includes a material including a polymer.

Abstract: An X-ray high-voltage generator comprises: a circuit arrangement having at least one power electronics circuit part, wherein the at least one power electronics circuit part is configured to form a heat source during operation; and a two-phase cooling system having a heat sink. The at least one power electronics circuit part is directly thermally coupled to the two-phase cooling system to cool the heat source at the heat sink. The two-phase cooling system has a cooling element block that spatially surrounds a cooling channel circuit. The cooling channel circuit is at least partially filled with a working medium, and is configured to act as a heat pipe.

Abstract: An electronic module includes a pulsating heat pipe having a channel structure for arrangement of a heat transport medium. The channel structure is formed of ceramic bodies, a metallic cover element, and a metallic carrier element. An electrical structural element is in contact with the heat transport medium.

Abstract: A heat transfer apparatus includes a heat chamber and a heat dissipating structure coupled to the heat chamber so as to jointly form a closed thermal circuit. The heat dissipating structure includes an outlet channel that leads off from the heat chamber and issues at an end that is remote from the heat chamber into a return duct which issues into the heat chamber. The return duct has a dimension which is smaller than a dimension of the outlet channel. The heat chamber is a boiling chamber or a steam chamber and the heat dissipating structure is a channel structure having steam regions and fluid regions. The heat chamber and the heat dissipating structure together form a pulsating or oscillating heating structure mechanism.

Abstract: A battery device comprises one or more battery modules, one of the respective battery modules comprising the following: a frame element, a base element and a plurality of battery cell.

Abstract: A battery device battery device comprises one or more battery modules, one of the respective battery modules comprising the following: a frame element, a base element and a plurality of battery cells.

Abstract: A heat transfer apparatus includes a heat chamber and a heat dissipating structure coupled to the heat chamber so as to jointly form a closed thermal circuit. The heat dissipating structure includes an outlet channel that leads off from the heat chamber and issues at an end that is remote from the heat chamber into a return duct which issues into the heat chamber. The return duct has a dimension which is smaller than a dimension of the outlet channel. The heat chamber is a boiling chamber or a steam chamber and the heat dissipating structure is a channel structure having steam regions and fluid regions. The heat chamber and the heat dissipating structure together form a pulsating or oscillating heating structure mechanism.