Patents by Inventor Florian Titjung

Florian Titjung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier with embedded component having pads connected in different wiring layers
    Patent number: 11240914
    Abstract: A component carrier includes a stack having at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, and a component embedded in the stack and having an array of pads on a main surface of the component. A first electrically conductive connection structure of the electrically conductive layer structures electrically connects a first pad of the pads up to a first wiring plane, and a second electrically conductive connection structure of the electrically conductive layer structures electrically connects a second pad of the pads up to a second wiring plane being different from the first wiring plane.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: February 1, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Florian Titjung, Wolfgang Schrittwieser
  • Component Carrier With Embedded Component Having Pads Connected in Different Wiring Layers
    Publication number: 20200100365
    Abstract: A component carrier includes a stack having at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, and a component embedded in the stack and having an array of pads on a main surface of the component. A first electrically conductive connection structure of the electrically conductive layer structures electrically connects a first pad of the pads up to a first wiring plane, and a second electrically conductive connection structure of the electrically conductive layer structures electrically connects a second pad of the pads up to a second wiring plane being different from the first wiring plane.
    Type: Application
    Filed: September 23, 2019
    Publication date: March 26, 2020
    Inventors: Florian Titjung, Wolfgang Schrittwieser