Patents by Inventor Florian WIEBERGER

Florian WIEBERGER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10815367
    Abstract: Thermoplastic moulding composition for 3D printing containing a polymer mixture A made of components a and b: a being from 30 to 95% by weight of at least one vinylaromatic copolymer a with average molar mass Mw from 150 000 to 360 000 g/mol, b being from 5 to 70% by weight of at least one impact modifier b, where the viscosity of the moulding composition (measured in accordance with ISO 11443) at shear rates of from 1 to 10 l/sec and at a temperature of 250° C. is not higher than 1×105 Pa*s and the Melt Volume Rate (MVR, measured in accordance with ISO 1133 for 220° C. and 10 kg load) is more than 6 ml/10 min.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: October 27, 2020
    Assignee: INEOS STYROLUTION GROUP GMBH
    Inventors: Norbert Niessner, Frank Eisentraeger, Stephanie Baumann, Itana Lohse, Hans-Werner Schmidt, Josef Meiners, Florian Wieberger
  • Patent number: 10717911
    Abstract: Thermally conductive polymer (TCP) resin compositions are described, comprising: 50 to 75% matrix polymer (I) comprising styrenic polymers (?) such as ABS (acrylonitrile-butadiene-styrene) resins, ASA (acrylonitrile-styrene-acrylate) resins and elastomeric block copolymers of the structure (S-(B/S))n-S; and 25 to 50% thermally conductive filler material (II) (D50 0.1 to 200 ?m), consisting of carbonyl iron powder (11-1) in mixture with multi wall carbon nanotubes, silicon carbide, diamond, graphite, aluminosilicates and/or boron nitride (II-2); wherein the volume ratio of (ll-1)/(ll-2) is 15:1 to 0.1:1. Shaped articles made thereof can be used for materials with antistatic finish, electrical and electronic housings, toys and helmet inlays.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: July 21, 2020
    Assignee: INEOS STYROLUTION GROUP GMBH
    Inventors: Tobias Schulz, Janna Michaelis De Vasconcellos, Gisbert Michels, Norbert Niessner, Hans-Werner Schmidt, Florian Wieberger, Tristan Kolb
  • Publication number: 20180291195
    Abstract: Thermally conductive polymer (TCP) resin composition (i) or (ii) are described, comprising components (I) and (II): (i) 40 to 72% by volume of at least one matrix polymer (I); 28 to 60% by volume of a thermally conductive filler material (II) (D50 0.1 to 200 ?m) consisting of aluminosilicate (II-1) in combination with a further component (II-2) selected from: multi wall carbon nanotubes, graphite and and boron nitride, wherein the volume ratio (ll-1)/(ll-2) is 30:1 to 0.1:1; or (ii) 40 to 65% by volume of at least one matrix polymer (I); 35 to 60% by volume of aluminosilicate (II) (D50 0.1 to 200 ?m); wherein the matrix polymer (I) comprises styrenic polymers (I?) selected from: ABS resins, ASA resins, and elastomeric block copolymers. Shaped articles made thereof can be used as “Cool Touch” surfaces for automobile interior, motor housings, lamp housings and electrical and electronic housings and as heat sinks for high performance electronics or LED sockets.
    Type: Application
    Filed: October 6, 2016
    Publication date: October 11, 2018
    Applicant: Ineos Styrolution Group GmbH
    Inventors: Tobias SCHULZ, Norbert NIESSNER, Gisbert MICHELS, Janna MICHAELIS DE VASCONCELLOS, Hans-Werner SCHMIDT, Florian WIEBERGER, Tristan KOLB
  • Publication number: 20180282604
    Abstract: Thermally conductive polymer (TCP) resin compositions are described, comprising: 50 to 75% matrix polymer (I) comprising styrenic polymers (F) such as ABS (acrylonitrile-butadiene-styrene) resins, ASA (acrylonitrile-styrene-acrylate) resins and elastomeric block copolymers of the structure (S-(B/S))n-S; and 25 to 50% thermally conductive filler material (II) (D50 0.1 to 200 ?m), consisting of carbonyl iron powder (II-1) in mixture with multi wall carbon nanotubes, silicon carbide, diamond, graphite, aluminosilicates and/or boron nitride (II-2); wherein the volume ratio of (II-1)/(II-2) is 15:1 to 0.1:1. Shaped articles made thereof can be used for materials with antistatic finish, electrical and electronic housings, toys and helmet inlays.
    Type: Application
    Filed: October 6, 2016
    Publication date: October 4, 2018
    Inventors: Tobias SCHULZ, Janna MICHAELIS DE VASCONCELLOS, Gisbert MICHELS, Norbert NIESSNER, Hans-Werner SCHMIDT, Florian WIEBERGER, Tristan KOLB
  • Publication number: 20160312022
    Abstract: Thermoplastic moulding composition for 3D printing containing a polymer mixture A made of components a and b: a being from 30 to 95% by weight of at least one vinylaromatic copolymer a with average molar mass Mw from 150 000 to 360 000 g/mol, b being from 5 to 70% by weight of at least one impact modifier b, where the viscosity of the moulding composition (measured in accordance with ISO 11443) at shear rates of from 1 to 10 l/sec and at a temperature of 250° C. is not higher than 1×105 Pa*s and the Melt Volume Rate (MVR, measured in accordance with ISO 1133 for 220° C. and 10 kg load) is more than 6 ml/10 min.
    Type: Application
    Filed: December 18, 2014
    Publication date: October 27, 2016
    Inventors: Norbert NIESSNER, Frank EISENTRAEGER, Stephanie BAUMANN, Itana RADOVANOVIC, Hans-Werner SCHMIDT, Josef MEINERS, Florian WIEBERGER