Abstract: The invention relates to an optoelectronic module, more particularly to an optoelectronic chip-on-board module. The optoelectronic module comprises a substrate, wherein the substrate has a planar design. Furthermore, the optoelectronic module comprises a plurality of optoelectronic components that are arranged on the substrate. Furthermore, the optoelectronic module comprises a lens system having a plurality of lenses. The lens system comprises at least two lenses with different directivities.

Abstract: A device and method are provided for controlling the temperature, in particular for cooling, of an LED lamp or LED modules of an LED lamp, e.g., for curing a light-cured pipe. The device includes: a fluid supply line and multiple heat exchangers connected to the supply line; multiple LEDs coupled to each heat exchanger with respect to heat transfer; and a fluid return line. The fluid supply and return lines are connected to each other in a fluid-tight manner by various combinations of L-pieces and T-pieces in or at the ends of the fluid supply and the return lines, so that the fluid flows from the LEDs in a spatially separated way and the fluid supply and return lines have at least two parallel fluid connections to each other, the heat exchangers being arranged in the fluid connections or constituting the fluid connections.

Abstract: A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement.

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract: A lighting device is provided for the uniform illumination of curved, uneven, or polyhedral surfaces. The lighting device has a plurality of flat chip-on-board LED modules, which are arranged adjacent to each other at least in pairs. Each chip-on-board LED module has a plurality of light-emitting LEDs. The lighting device is characterized by at least one pair of the adjacent chip-on-board LED modules being arranged at an angle greater than 0° with respect to the surface normals of the modules.

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract: A method is provided for production of a module, including the steps of: (a) providing a substrate (1) having a first surface (5); (b) providing an open casting mold (6), wherein the formation of at least one optical element (4, 4?) is provided in the casting mold (6); (c) coating the first surface (5) with an adhesion promoter (2); (d) covering the coated surface (2, 5) with a silicone (3) in the open casting mold while forming the optical element from the silicone (3); and (e) curing the silicone in the casting mold.

Abstract: A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement.

Abstract: A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement.

Abstract: Systems and methods for hierarchically partitioning a data set including a plurality of offerings are described. A system receives a data set including a plurality of offerings characterized by one or more offering attributes. The system identifies one or more candidate offering attributes associated with the offerings according to which the offerings are to be partitioned. The system assigns a partition hierarchy level to each of the candidate offering attributes that indicates a hierarchy of the offering attribute relative to other candidate offering attributes. The system determines, for each of the candidate offering attributes, a plurality of attribute values according to which the offerings are to be partitioned.

Abstract: The invention relates to an optoelectronic module (112), more particularly to an optoelectronic chip-on-board module (114). The optoelectronic module (112) comprises a substrate (116), wherein the substrate (116) has a planar design. Furthermore, the optoelectronic module (112) comprises a plurality of optoelectronic components (118) that are arranged on the substrate (116). Furthermore, the optoelectronic module (112) comprises a lens system (122) having a plurality of lenses (124). The lens system (122) comprises at least two lenses (124) with different directivities.

Abstract: A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement.

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract: A device and method are provided for controlling the temperature, in particular for cooling, of an LED lamp or LED modules of an LED lamp, e.g., for curing a light-cured pipe. The device includes: a fluid supply line and multiple heat exchangers connected to the supply line; multiple LEDs coupled to each heat exchanger with respect to heat transfer; and a fluid return line. The fluid supply and return lines are connected to each other in a fluid-tight manner by various combinations of L-pieces and T-pieces in or at the ends of the fluid supply and the return lines, so that the fluid flows from the LEDs in a spatially separated way and the fluid supply and return lines have at least two parallel fluid connections to each other, the heat exchangers being arranged in the fluid connections or constituting the fluid connections.

Abstract: A lighting device (40-40?, 45-45?, 50-50?, 60, 80, 93-93?) is provided for the uniform illumination of curved, uneven, or polyhedral surfaces. The lighting device has a plurality of flat chip-on-board LED modules (1, 11, 11?, 21, 31, 41-41?, 46-46?, 51-51?, 61-61?, 71-71??, 811-818), which are arranged adjacent to each other at least in pairs. Each chip-on-board LED module (1, 11, 11?, 21, 31, 41-41?, 46-46?, 51-51?, 61-61?, 71-811-818) has a plurality of light-emitting LEDs (4, 4?, 14, 14?, 24, 34, 64, 72). The lighting device (40-40?, 45-45?, 50-50?, 60, 80, 93-93?) is characterized by at least one pair of the adjacent chip-on-board LED modules (1, 11, 11?, 21, 31, 41-41?, 46-46?, 51-51?, 61-61?, 71-71??, 811-818) being arranged at an angle greater than 0° with respect to the surface normals of the modules.

Abstract: A housing for an electromagnetic-radiation-emitting optoelectronic component. Exterior side faces of the housing are at least partly provided with a screening layer suitable for screening an electromagnetic radiation. A lateral emission of electromagnetic radiation from the housing, which is disadvantageous for many applications, is thereby intended to be avoided. An electromagnetic-radiation-emitting component having a housing of this type and a method for producing a corresponding housing or component are additionally described.

Abstract: A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.

Abstract: A light-emitting module is specified that comprises a light source, a carrier for said light source, and an optical element, wherein the optical element comprises dowel pins that engage in corresponding recesses in the carrier. The light-emitting module is particularly well suited for use in optical projection apparatuses and in motor vehicle projection lamps.

Abstract: A housing for an electromagnetic-radiation-emitting optoelectronic component. Exterior side faces of the housing are at least partly provided with a screening layer suitable for screening an electromagnetic radiation. A lateral emission of electromagnetic radiation from the housing, which is disadvantageous for many applications, is thereby intended to be avoided. An electromagnetic-radiation-emitting component having a housing of this type and a method for producing a corresponding housing or component are additionally described.