Patents by Inventor Florine Bourdet

Florine Bourdet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6580151
    Abstract: The present invention relates to a method of thinning of a single-crystal silicon wafer so that the wafer has a final thickness lower than 80 &mgr;m.
    Type: Grant
    Filed: October 15, 1998
    Date of Patent: June 17, 2003
    Assignee: STMicroelectronics S.A.
    Inventors: Jacques Vandeputte, Florine Bourdet
  • Publication number: 20020050624
    Abstract: The present invention relates to a method of thinning of a single-crystal silicon wafer so that the wafer has a final thickness lower than 80 &mgr;m.
    Type: Application
    Filed: October 15, 1998
    Publication date: May 2, 2002
    Inventors: JACQUES VANDEPUTTE, FLORINE BOURDET