Patents by Inventor Floyd Schemmel

Floyd Schemmel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for automatically detecting defects on silicon dies on silicon wafers
    Patent number: 6895109
    Abstract: An apparatus and method for automatically detecting defects on silicon dies on silicon wafers comprising a silicon wafer acquisition system (30) and a computer (32) connected to said silicon wafer image acquisition system (10), wherein said computer (32) automatically aligns a silicon wafer (16), calibrates the image acquisition system (30), analyzes die images by determining a statistical die model from a plurality of dies, and compares the statistical die model to silicon die images to determine if the silicon dies have surface defects, is disclosed.
    Type: Grant
    Filed: September 4, 1997
    Date of Patent: May 17, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Floyd Schemmel, Richard Thorne
  • Apparatus and method for automatically detecting defects on silicon dies on silicon wafers
    Patent number: 6504948
    Abstract: An apparatus and method for automatically detecting defects on silicon dies on silicon wafers comprising a silicon wafer acquisition system (30) and a computer (32) connected to said silicon wafer image acquisition system (10), wherein said computer (32) automatically aligns a silicon wafer (16), calibrates the image acquisition system (30), analyzes die images by determining a statistical die model from a plurality of dies, and compares the statistical die model to silicon die images to determine if the silicon dies have surface defects, is disclosed.
    Type: Grant
    Filed: April 15, 1999
    Date of Patent: January 7, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Floyd Schemmel, Richard Thorne
  • Apparatus for detecting defective integrated circuit dies in wafer form
    Patent number: 6175646
    Abstract: An apparatus and method for detecting defects on silicon dies on a silicon wafer (16) comprising an image acquisition system (10) and a computer (32) that determines a statistical die model by analyzing a random selection of dies (42) within a die matrix (37) and compares the statistical die model to matrices of silicon dies (38) to determine which silicon dies (38) have surface defects, is disclosed.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: January 16, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Floyd Schemmel, Richard Thorne
  • Apparatus and method for detecting defects on silicon dies on a silicon wafer
    Patent number: 5943551
    Abstract: An apparatus and method for detecting defects on silicon dies on a silicon wafer (16) comprising an image acquisition system (10) and a computer (32) that determines a statistical die model by analyzing a random selection of dies (42) within a die matrix (37) and compares the statistical die model to matrices of silicon dies (38) to determine which silicon dies (38) have surface defects, is disclosed.
    Type: Grant
    Filed: September 4, 1997
    Date of Patent: August 24, 1999
    Assignee: Texas Instruments Incorporated
    Inventors: Floyd Schemmel, Richard Thorne