Patents by Inventor Fong-An Kan

Fong-An Kan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11757216
    Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: September 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Fong-An Kan, Ming Chu Kuo, Yi-Chu Hsieh, Chun-Min He
  • Patent number: 11758642
    Abstract: In one embodiment, a grounding structure for a printed circuit board (PCB) of an information handling system includes: a first ground via electrically coupled to a ground layer of the PCB; a second ground via electrically coupled to the ground layer of the PCB; and a conductive strip electrically coupling the first ground via to the second ground via, the conductive strip providing a vertical ground reference for a signal transferred from a first surface of the PCB to a second surface of the PCB through a signal via disposed on the PCB.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: September 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Fong-An Kan, Chian-Ting Chen, Po Hsiang Chuang
  • Publication number: 20230253723
    Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 10, 2023
    Inventors: Fong-An Kan, Ming Chu Kuo, Yi-Chu Hsieh, Chun-Min He
  • Publication number: 20230199938
    Abstract: In one embodiment, a grounding structure for a printed circuit board (PCB) of an information handling system includes: a first ground via electrically coupled to a ground layer of the PCB; a second ground via electrically coupled to the ground layer of the PCB; and a conductive strip electrically coupling the first ground via to the second ground via, the conductive strip providing a vertical ground reference for a signal transferred from a first surface of the PCB to a second surface of the PCB through a signal via disposed on the PCB.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 22, 2023
    Inventors: Fong-An Kan, Chian-Ting Chen, Po Hsiang Chuang