Abstract: A door position detector including a strike plate mounted onto a door frame. The strike plate includes a back face that opposes the door frame and a front face disposed on an opposite side of the strike plate than the back face and opposing an edge of a door when the door is in a closed position. The door position detector further including a door position sensor integrated with the strike plate, the door position sensor configured to detect a state of the door.

Abstract: A door position detector including a strike plate mounted onto a door frame. The strike plate includes a back face that opposes the door frame and a front face disposed on an opposite side of the strike plate than the back face and opposing an edge of a door when the door is in a closed position. The door position detector further including a door position sensor integrated with the strike plate, the door position sensor configured to detect a state of the door.

Abstract: A method and apparatus is described for transmitting event codes from a base station to a remote location. In one embodiment, a method is described, executed by a processor within an event communication module, the method comprising receiving an encoded event code from a base station over an interface connection, selecting a first transmission method from two or more communication methods based on the received event code, encoding the event code based on the first communication method, and transmitting the encoded event code to remote location by a communication module configured to communicate using the first communication method.

Abstract: A method and apparatus is described for transmitting event codes from a base station to a remote location. In one embodiment, a method is described, executed by a processor within an event communication module, the method comprising receiving an encoded event code from a base station over an interface connection, selecting a first transmission method from two or more communication methods based on the received event code, encoding the event code based on the first communication method, and transmitting the encoded event code to remote location by a communication module configured to communicate using the first communication method.

Abstract: A method and apparatus is described for transmitting event codes from a base station to a remote location. In one embodiment, a method is described, executed by a processor within an event communication module, the method comprising receiving an encoded event code from a base station over an interface connection, selecting a first transmission method from two or more communication methods based on the received event code, encoding the event code based on the first communication method, and transmitting the encoded event code to remote location by a communication module configured to communicate using the first communication method.

Abstract: A headwear assembly, comprising a crown, a bill attached to said crown, and extending outwardly therefrom. The bill comprises an upper bill portion comprising a first periphery and a first closure means disposed along that first periphery, a lower bill portion comprising a second periphery and a second closure means disposed along that second periphery, wherein the first periphery can be releaseably attached to the second periphery by releaseably attaching the first closure means to the second closure means to define an enclosed space between the upper bill portion and the lower bill portion.

Abstract: A headwear assembly, comprising a crown, a bill attached to said crown, and extending outwardly therefrom. The bill comprises an upper bill portion comprising a first periphery and a first closure means disposed along that first periphery, a lower bill portion comprising a second periphery and a second closure means disposed along that second periphery, wherein the first periphery can be releaseably attached to the second periphery by releaseably attaching the first closure means to the second closure means to define an enclosed space between the upper bill portion and the lower bill portion.

Abstract: A pet carrying apparatus in which a pet can get in or out of a bag structure by itself is provided. The bag structure has a definite inner space defined by a bag body, a positioning frame that is positioned on a periphery the bag body, and a front layer defining a pet opening therein, whereby a pet can get in or out of the inner space. The apparatus further has a vehicle body that defines a vehicle inner space. The vehicle body has a frame and a set of attached wheels. The apparatus also has a pair of connecting devices positioned opposite of each other. Each of the connecting devices being located at an inner side of the vehicle body such that when the bag structure is placed within the vehicle inner space, the pair of connecting devices is symmetrically placed on the positioning frame.

Abstract: A method and apparatus for depositing a low dielectric constant film by plasma assisted copolymerization of p-xylylene and a comonomer having carbon-carbon double bonds at a constant RF power level from about 0W to about 100W or a pulsed RF power level from about 20W to about 160W. The copolymer film has a dielectric constant from about 2.2 to about 2.5. Preferred comonomers include tetravinyltetramethylcyclotetrasiloxane, tetraallyloxysilane, and trivinylmethylsilane. The copolymer films include at least 1% by weight of the comonomer.

Abstract: Generally, a substrate processing apparatus is provided. In one aspect of the invention, a substrate processing apparatus is provided. In one embodiment, the substrate processing apparatus includes one or more chamber bodies coupled to a gas distribution system. The chamber bodies define at least a first processing region and a second processing region within the chamber bodies. The gas distribution system includes a first, a second and a third gas supply circuit. The first gas supply circuit is teed between the first and second processing regions and is adapted to supply a first processing gas thereto. The second gas supply circuit is coupled to the first processing region and adapted to supply a second process gas thereto. The third gas supply circuit is coupled to the second processing region and is adapted to supply a third process gas thereto. Alternatively, the processing regions may be disposed in a single chamber body.

Abstract: A method for forming thin polymer layers having low dielectric constants or semiconductor substrates. In one embodiment, the method includes the vaporization of stable di-p-xylylene, the pyrolytic conversion of such gaseous dimer material into reactive monomers, and blending of the resulting gaseous p-xylylene monomers with one or more comonomers having silicon-oxygen bonds and at least two pendent carbon--carbon double bonds. The copolymer films have low dielectric constants, improved thermal stability, and excellent adhesion to silicon oxide layers in comparison to parylene-N homopolymers.

Abstract: An apparatus for in-situ control of the flow of a liquid precursor into a deposition chamber comprises a liquid injection system having a liquid injection outlet connected to a chamber inlet line upstream of the deposition chamber. The liquid injection system includes a liquid precursor supply, a carrier gas supply, a vaporizer, and a controller managing flows of the liquid precursor and carrier gas to the chamber. A bypass line is connected to the chamber inlet line and includes a bypass valve, a sonic orifice, and a pressure gauge upstream of the sonic orifice. To calibrate the flow of the liquid precursor, a flow of carrier gas is directed into the bypass line at a carrier gas sonic flow rate. A first steady state pressure is measured with the pressure gauge. The liquid precursor is vaporized and directed to the flow of carrier gas into the bypass line. A second steady state pressure is measured with the pressure gauge.

Abstract: The present invention provides systems, methods and apparatus for high temperature (at least about 500-800.degree. C.) processing of semiconductor wafers. The systems, methods and apparatus of the present invention allow multiple process steps to be performed in situ in the same chamber to reduce total processing time and to ensure high quality processing for high aspect ratio devices. Performing multiple process steps in the same chamber also increases the control of the process parameters and reduces device damage. In particular, the present invention can provide high temperature deposition, heating and efficient cleaning for forming dielectric films having thickness uniformity, good gap fill capability, high density, low moisture, and other desired characteristics.

Abstract: An apparatus for controlling the flow of a liquid precursor into a deposition chamber comprises a liquid injection system having a liquid injection outlet connected to a chamber inlet line upstream of the deposition chamber. The liquid injection system includes a liquid precursor supply, a purge gas supply, a carrier gas supply, a liquid flow meter, and a controller managing flows of the liquid precursor and carrier gas to the chamber. A purge line is connected between the purge gas supply and the liquid flow meter and is used to trap a known mass of liquid precursor. To calibrate the flow of the liquid precursor, the purge gas is used to push the trapped liquid precursor through the liquid flow meter at a steady rate. The elapsed time for evacuating the trapped liquid precursor from the purge line is measured. Calibration information is computed using the mass of the trapped liquid precursor and the measured elapsed time based on the direct liquid measurement approach.