Abstract: The present invention relates to a hard and wear-resisting probe and manufacturing method thereof, and particularly relates to a hard and wear-resisting probe comprising tungsten steel (WC) and manufacturing method thereof. This hard and wear-resisting probe is substantially made of a tungsten steel with high hardness and wear resistance so that the probe is difficult to be worn and the lifetime of the probe is longer. Furthermore, the frequencies for changing the probe and the cost of testing are reduced, and the testing efficiency can be improved.

Abstract: A semiconductor test equipment with concentric pogo towers is disclosed, which comprises a base, a tester head, an outer pogo tower, and an inner pogo tower. The inner pogo tower is concentrically received in the outer pogo tower, and a connecting slot of the inner pogo tower is correspondingly engaged with a connecting pin of the outer pogo tower. The outer pogo tower is fixed to the load board together with the inner pogo tower, whereby a plurality of outer pogo pins of the outer pogo tower and a plurality of inner pogo pins of the inner pogo tower are electrically connected to the load board respectively. Therefore, the present invention is capable of expanding the test specifications, but also to change rapidly from different test specifications through replacing a different probe card but without to modify any other hardware.

Abstract: A semiconductor test equipment with concentric pogo towers is disclosed, which comprises a base, a tester head, an outer pogo tower, and an inner pogo tower. The inner pogo tower is concentrically received in the outer pogo tower, and a connecting slot of the inner pogo tower is correspondingly engaged with a connecting pin of the outer pogo tower. The outer pogo tower is fixed to the load board together with the inner pogo tower, whereby a plurality of outer pogo pins of the outer pogo tower and a plurality of inner pogo pins of the inner pogo tower are electrically connected to the load board respectively. Therefore, the present invention is capable of expanding the test specifications, but also to change rapidly from different test specifications through replacing a different probe card but without to modify any other hardware.