Patents by Inventor Fong Kok Chin

Fong Kok Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple die stack package
    Patent number: 8288862
    Abstract: A semiconductor package, containing two or more stacked IC devices attached to a substrate. Each of the IC devices has a plurality of electrical contact regions which are connected to the substrate by means of electrical connections.
    Type: Grant
    Filed: February 11, 2003
    Date of Patent: October 16, 2012
    Assignee: United Test & Assembly Center Limited
    Inventors: Wang Chuen Khiang, Koh Yong Chuan, Fong Kok Chin
  • Semiconductor package
    Publication number: 20030197284
    Abstract: A semiconductor package, containing two or more stacked IC devices attached to a substrate. Each of the IC devices has a plurality of electrical contact regions which are connected to the substrate by means of electrical connections.
    Type: Application
    Filed: February 11, 2003
    Publication date: October 23, 2003
    Applicant: United Test & Assembly Center Limited
    Inventors: Wang Chuen Khiang, Koh Yong Chuan, Fong Kok Chin