Patents by Inventor FONG LIANG TAN
FONG LIANG TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10237985Abstract: The present disclosure provides a method to provide a conductive bus bar on a patterned transparent conductor, such as ITO traces used for touch screen manufacturing. The method can be a cheaper and a more convenient technique to pattern a conductive metal or metal alloy, such as copper, silver, or a copper/silver/titanium alloy, on ITO electrodes in a roll-to-roll process.Type: GrantFiled: June 12, 2015Date of Patent: March 19, 2019Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Muthu Sebastian, Fong Liang Tan
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Publication number: 20170290212Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.Type: ApplicationFiled: June 19, 2017Publication date: October 5, 2017Inventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agacaoili Narag, Siang Sin Foo, Fong Liang Tan, Wei Meng Pee, Andrew J. Ouderkirk, Justine A. Mooney
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Patent number: 9716061Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.Type: GrantFiled: February 17, 2012Date of Patent: July 25, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Wei Meng Pee, Andrew J. Ouderkirk, Justine A. Mooney
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Patent number: 9698563Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.Type: GrantFiled: October 27, 2011Date of Patent: July 4, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, James R. White, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney, Nathan P. Kreutter, Qihong Nie, Jian Xia Gao
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Patent number: 9674938Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.Type: GrantFiled: October 27, 2011Date of Patent: June 6, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, James R. White, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney, Nathan P. Kreutter, Qihong Nie, Jian Xia Gao
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Publication number: 20170135229Abstract: The present disclosure provides a method to provide a conductive bus bar on a patterned transparent conductor, such as ITO taces used for touch screen manufacturing. The method can be a cheaper and a more convenient technique to pattern a conductive metal or metal alloy, such as copper, silver, or a copper/silver/titanium alloy, on ITO electrodes in a roll-to-roll process.Type: ApplicationFiled: June 12, 2015Publication date: May 11, 2017Inventors: Muthu Sebastian, Fong Liang Tan
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Patent number: 9564568Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.Type: GrantFiled: September 21, 2015Date of Patent: February 7, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney
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Publication number: 20160049567Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.Type: ApplicationFiled: September 21, 2015Publication date: February 18, 2016Inventors: Ravi PALANISWAMY, Arokiaraj JESUDOSS, Alejandro Aldrin II Agcaoili NARAG, Siang Sin FOO, Fong Liang TAN, Andrew J. OUDERKIRK, Justine A. MOONEY
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Patent number: 9179543Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.Type: GrantFiled: October 27, 2011Date of Patent: November 3, 2015Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney
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Patent number: 9023229Abstract: A double ITO structure, containing sequential layers of indium tin oxide (ITO), silicon dioxide (SiO2) (which may include a dopant material) and ITO, is selectively protected by a patterned photo-resist mask. The sequential layers are etched together in a single etching step using an etchant composition which is an acidic solution containing a transition metal chloride and hydrochloric acid (HCl). Thus, the double ITO structure is etched using a substantially fluoride-free etchant composition.Type: GrantFiled: July 13, 2012Date of Patent: May 5, 2015Assignee: 3M Innovative Properties CompanyInventors: Muthu Sebastian, Fong Liang Tan
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Publication number: 20140124477Abstract: A double ITO structure, containing sequential layers of indium tin oxide (ITO), silicon dioxide (SiO2) (which may include a dopant material) and ITO, is selectively protected by a patterned photo-resist mask. The sequential layers are etched together in a single etching step using an etchant composition which is an acidic solution containing a transition metal chloride and hydrochloric acid (HCl). Thus, the double ITO structure is etched using a substantially fluoride-free etchant composition.Type: ApplicationFiled: July 13, 2012Publication date: May 8, 2014Inventors: Muthu Sebastian, Fong Liang Tan
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Publication number: 20140036461Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.Type: ApplicationFiled: October 27, 2011Publication date: February 6, 2014Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agcaoili Narag, James R White, Fong Liang Tan, Andrew J Ouderkirk, Justine A Mooney, Nathan P Kreutter, Qihong Nie, Jian Xia Gao
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Publication number: 20130320390Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.Type: ApplicationFiled: February 17, 2012Publication date: December 5, 2013Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Agcaoili Narag, II, Siang Sin Foo, Fong Liang Tan, Wei Meng Pee, Andrew J. Ouderkirk, Justine A. Mooney
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Publication number: 20130294471Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.Type: ApplicationFiled: October 27, 2011Publication date: November 7, 2013Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agcaoili Narag, James R. White, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney, Nathan P. Kreutter, Qihong Nie, Jian Xia Gao
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Publication number: 20130213697Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.Type: ApplicationFiled: October 27, 2011Publication date: August 22, 2013Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney
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Publication number: 20110284268Abstract: Provided is a means of improving the adhesion between a flexible circuit coverfilm and an encapsulant material in an inkjet printer application.Type: ApplicationFiled: May 6, 2011Publication date: November 24, 2011Inventors: RAVI PALANISWAMY, FONG LIANG TAN, RONALD L. IMKEN, ROBIN E. GORRELL