Patents by Inventor Fong Mei Lum

Fong Mei Lum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220005778
    Abstract: A method for fabricating a semiconductor device with a heterogeneous solder joint includes: providing a semiconductor die; providing a coupled element; and soldering the semiconductor die to the coupled element with a first solder joint. The first solder joint includes: a solder material including a first metal composition; and a coating including a second metal composition, different from the first metal composition, the coating at least partially covering the solder material. The second metal composition has a greater stiffness and/or a higher melting point than the first metal composition.
    Type: Application
    Filed: June 29, 2021
    Publication date: January 6, 2022
    Inventors: Swee Kah Lee, Sook Woon Chan, Fong Mei Lum, Joachim Mahler, Muhammad Muhammat Sanusi
  • Publication number: 20200006267
    Abstract: A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main surfaces. A semiconductor die is embedded in the mold compound. A plurality of metal pads embedded in the mold compound are electrically connected to the semiconductor die. The metal pads have a bottom face which is uncovered by the mold compound at the second main surface of the mold compound. The metal pads disposed around a periphery of the molded package have a side face which is uncovered by the mold compound at the edge of the mold compound. The faces of the metal pads uncovered by the mold compound are plated. The side face of each metal pad disposed around the periphery of the molded package is recessed inward from the edge of the mold compound. A corresponding manufacturing method is also described.
    Type: Application
    Filed: September 10, 2019
    Publication date: January 2, 2020
    Inventors: Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi, Soon Lock Goh
  • Patent number: 10431560
    Abstract: A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main surfaces. A semiconductor die is embedded in the mold compound. A plurality of metal pads embedded in the mold compound are electrically connected to the semiconductor die. The metal pads have a bottom face which is uncovered by the mold compound at the second main surface of the mold compound. The metal pads disposed around a periphery of the molded package have a side face which is uncovered by the mold compound at the edge of the mold compound. The faces of the metal pads uncovered by the mold compound are plated. The side face of each metal pad disposed around the periphery of the molded package is recessed inward from the edge of the mold compound. A corresponding manufacturing method is also described.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: October 1, 2019
    Assignee: Infineon Technologies AG
    Inventors: Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi, Soon Lock Goh
  • Publication number: 20180033752
    Abstract: A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main surfaces. A semiconductor die is embedded in the mold compound. A plurality of metal pads embedded in the mold compound are electrically connected to the semiconductor die. The metal pads have a bottom face which is uncovered by the mold compound at the second main surface of the mold compound. The metal pads disposed around a periphery of the molded package have a side face which is uncovered by the mold compound at the edge of the mold compound. The faces of the metal pads uncovered by the mold compound are plated. The side face of each metal pad disposed around the periphery of the molded package is recessed inward from the edge of the mold compound. A corresponding manufacturing method is also described.
    Type: Application
    Filed: October 11, 2017
    Publication date: February 1, 2018
    Inventors: Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi, Soon Lock Goh
  • Patent number: 9806043
    Abstract: A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main surfaces. A semiconductor die is embedded in the mold compound. A plurality of metal pads are also embedded in the mold compound and electrically connected to the semiconductor die. The metal pads have a bottom face which is uncovered by the mold compound at the second main surface of the mold compound. The metal pads disposed around a periphery of the molded package have a side face which is uncovered by the mold compound at the edge of the mold compound. The faces of the metal pads uncovered by the mold compound are plated. The side face of each metal pad disposed around the periphery of the molded package is recessed inward from the edge of the mold compound. A corresponding manufacturing method is also described.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: October 31, 2017
    Assignee: Infineon Technologies AG
    Inventors: Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi, Soon Lock Goh
  • Publication number: 20170256509
    Abstract: A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main surfaces. A semiconductor die is embedded in the mold compound. A plurality of metal pads are also embedded in the mold compound and electrically connected to the semiconductor die. The metal pads have a bottom face which is uncovered by the mold compound at the second main surface of the mold compound. The metal pads disposed around a periphery of the molded package have a side face which is uncovered by the mold compound at the edge of the mold compound. The faces of the metal pads uncovered by the mold compound are plated. The side face of each metal pad disposed around the periphery of the molded package is recessed inward from the edge of the mold compound. A corresponding manufacturing method is also described.
    Type: Application
    Filed: March 3, 2016
    Publication date: September 7, 2017
    Inventors: Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi, Soon Lock Goh