Patents by Inventor Fong P. Chang

Fong P. Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board having U-shaped solder mask layer separating respective contacts
    Patent number: 5386087
    Abstract: A circuit pattern layer is formed over the surface of a laminated board such that it includes one array of solder pads. The circuit pattern layer has its surface covered with a solder mask layer. The solder mask layer has a U-shaped recess at the area of the solder pad. The solder pad is exposed at the area of the U-shaped recess. Upon the soldering of the connector's connection terminal to the solder pad at the area of the U-shaped recess, a molten solder is kept in the U-shaped recess and prevented from flowing onto the adjacent connection terminal. It is thus possible to prevent a solder bridge from being created across those connection terminals.
    Type: Grant
    Filed: February 16, 1993
    Date of Patent: January 31, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Chen W. Lee, Fong P. Chang, Chou L. Chen