Patents by Inventor Fong Yeh
Fong Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230290077Abstract: A virtual window configuration method includes the following steps. A processor generates a virtual window. A depth detection sensor generates depth information based on an image. The processor analyzes the depth information to generate a depth matrix. The processor finds a depth configuration block in the image using the depth matrix. A feature point detection sensor generates feature point information for the image. The processor analyzes the feature point information to generate a feature point matrix. The processor finds a feature point configuration block in the image using the feature point matrix. The processor moves the virtual window to the depth configuration block or the feature point configuration block.Type: ApplicationFiled: September 13, 2022Publication date: September 14, 2023Inventors: Wei-Chou CHEN, Ming-Fong YEH, Yu-Chi CHANG, Lee-Chun KO
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Patent number: 11404361Abstract: A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.Type: GrantFiled: November 12, 2020Date of Patent: August 2, 2022Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai
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Publication number: 20210066173Abstract: A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.Type: ApplicationFiled: November 12, 2020Publication date: March 4, 2021Inventors: Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai
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Patent number: 10872847Abstract: A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.Type: GrantFiled: September 29, 2017Date of Patent: December 22, 2020Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai
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Publication number: 20180342446Abstract: A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.Type: ApplicationFiled: September 29, 2017Publication date: November 29, 2018Inventors: Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai
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Patent number: 9978673Abstract: A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.Type: GrantFiled: January 4, 2017Date of Patent: May 22, 2018Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Shao-Tzu Tang, Jia-Fong Yeh, Chien-Hui Wang, Chung-Yan Huang, Ying-Chou Tsai
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Publication number: 20180061747Abstract: A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.Type: ApplicationFiled: January 4, 2017Publication date: March 1, 2018Inventors: Shao-Tzu Tang, Jia-Fong Yeh, Chien-Hui Wang, Chung-Yan Huang, Ying-Chou Tsai
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Publication number: 20160021690Abstract: The invention introduces a method for establishing a direct connection, executed by a processing unit of a first electronic apparatus, which contains at least the following steps. A first location of the first electronic apparatus and an angle of the first electronic apparatus are obtained. Second locations are collected via a communications interface of the first electronic apparatus, where each second location is of a second electronic apparatus. It is determined which of the second electronic apparatuses the first electronic apparatus is aimed at, according to the first location, the second locations, and the angle of the first electronic apparatus. A direct connection is established with the determined second electronic apparatus via the first communications interface.Type: ApplicationFiled: December 31, 2014Publication date: January 21, 2016Inventor: Ming-Fong YEH
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Patent number: 9237592Abstract: The invention introduces a method for establishing a direct connection, executed by a processing unit of a first electronic apparatus, which contains at least the following steps. A first location of the first electronic apparatus and an angle of the first electronic apparatus are obtained. Second locations are collected via a communications interface of the first electronic apparatus, where each second location is of a second electronic apparatus. It is determined which of the second electronic apparatuses the first electronic apparatus is aimed at, according to the first location, the second locations, and the angle of the first electronic apparatus. A direct connection is established with the determined second electronic apparatus via the first communications interface.Type: GrantFiled: December 31, 2014Date of Patent: January 12, 2016Assignee: Wistron Corp.Inventor: Ming-Fong Yeh
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Patent number: 8711706Abstract: A protocol delay measuring device prevents an increase of the processing overhead of a communication terminal attributed to a protocol delay measurement. The measuring device determines the protocol delay by using first and second timestamps created respectively before and after a processed packet is obtained from an unprocessed packet by IPsec processing by the communication terminal. An acknowledges creates an identifier of the unprocessed packet. A timestamp database stores the created identifier along with the first timestamp and writes the identifier in a storage where the identifier is kept the same before and after the IPsec processing by the communication terminal. A correlator reads the identifier from the storage and extracts the first timestamp stored along with the same identifier as the read identifier in the timestamp database. A calculator calculates the difference between the extracted first timestamp and the second timestamp as the protocol delay.Type: GrantFiled: December 15, 2008Date of Patent: April 29, 2014Assignee: Panasonic CorporationInventors: Satoshi Senga, Kazushige Yamada, Ming-Fong Yeh
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Publication number: 20120162227Abstract: A method of displaying a picture for an electronic device with picture display function includes determining whether a resolution of a picture inputted into the electronic device is greater than a resolution of a display device of the electronic device, displaying the picture in the display device when the resolution of the picture is smaller or equivalent to the resolution of the display device, and reducing the resolution of the picture and then displaying the reduced picture in the display device when the resolution of the picture is greater than the resolution of the display device.Type: ApplicationFiled: March 23, 2011Publication date: June 28, 2012Inventors: Li-Po Chou, Ming-Fong Yeh, Yu-Chi Chang
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Patent number: 8024011Abstract: A method for intercepting signals so as to change the ring mode of a mobile device includes the following steps. Initially, a signal about to enter a predetermined area is intercepted. Then, a specific ring mode is added to the signal according to contents of the signal. Next, the signal having the specific ring mode is sent to a mobile device located in the predetermined area. Subsequently, the mobile device uses the specific ring mode as the ring mode of the mobile device upon receipt of the signal. A device applying the method is also disclosed.Type: GrantFiled: June 2, 2006Date of Patent: September 20, 2011Assignee: Panasonic CorporationInventor: Ming-Fong Yeh
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Publication number: 20100260062Abstract: A protocol delay measuring device (100) for preventing an increase of the processing overhead of a communication terminal attributed to a protocol delay measurement. The protocol delay measuring device (100) determines the protocol delay by using first and second timestamps created respectively before and after a processed packet is obtained from an unprocessed packet by IPsec processing by the communication terminal. An acknowledging section (104) creates an identifier of the unprocessed packet. A timestamp database (106) stores the created identifier along with the first timestamp and writes the identifier in a storage area where the identifier is kept the same before and after the IPsec processing by the communication terminal. A correlating section (108) reads the identifier from the storage area and extracts the first timestamp stored along with the same identifier as the read identifier in the timestamp database (106).Type: ApplicationFiled: December 15, 2008Publication date: October 14, 2010Applicant: PANASONIC CORPORATIONInventors: Satoshi Senga, Kazushige Yamada, Ming-Fong Yeh
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Publication number: 20090113063Abstract: In an authentication method for integrating ticket-granting service into session initiation protocol, a server provides session initiation protocol and ticket-granting services between a calling facility and a called facility, and the method includes enabling the calling facility to obtain a first ticket from the server, and subsequently issue an INVITE message containing the first ticket attached thereto to the server. If the server verifies that the first ticket be issued by the server itself, the server examines the registration status of the called facility in the server. If the status of the called facility is registered, identity authentication of the calling facility and called facility proceeds according to a predetermined ticket authentication procedure. If the authentication is successful, the called facility can establish a communication session with the calling facility.Type: ApplicationFiled: June 13, 2007Publication date: April 30, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventor: Ming-Fong Yeh
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Publication number: 20090029742Abstract: A method for intercepting signals so as to change the ring mode of a mobile device includes the following steps. Initially, a signal about to enter a predetermined area is intercepted. Then, a specific ring mode is added to the signal according to contents of the signal. Next, the signal having the specific ring mode is sent to a mobile device located in the predetermined area. Subsequently, the mobile device uses the specific ring mode as the ring mode of the mobile device upon receipt of the signal. A device applying the method is also disclosed.Type: ApplicationFiled: June 2, 2006Publication date: January 29, 2009Applicant: Matsushita Electric Industrial Co., Ltd.Inventor: Ming-Fong Yeh
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Publication number: 20060076782Abstract: A wind-guidance enhancing apparatus for a wind power generator includes a support stage; an impeller stage including at least one blade, and a wind-guidance unit for guiding wind to the impeller stage. The wind-guidance unit includes a plurality of wind-guidance plates having wind-guidance faces, wind-guidance gates, and wind-guidance runners defined between adjacent wind-guidance faces and being shrunk toward the impeller stage. The wind-guidance gate is designed to be movable to adjust the width and flowing direction of outlets of the wind-guidance runners. Moreover, the wind-guidance enhancing apparatus further includes at least one gutter plate and the wind-guidance plates are arranged corresponding to a reference plate to enhance wind capturing angle.Type: ApplicationFiled: October 6, 2005Publication date: April 13, 2006Inventors: Don-Fong Yeh, Kun-Lung Tsai
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Patent number: 6797067Abstract: An invention is provided for an implanter tool process parameter setup system. The implanter tool process parameter setup system includes a first sensor capable of obtaining a first lot identifier (ID) from a first POD, and a controller that is in communication with an implanter tool. The controller is capable of adjusting parameters of the implanter tool based on a process recipe. Further included in the system is a database that stores a plurality of lot IDs and a plurality of process recipes, wherein each lot ID corresponds to a particular process recipe. A computer is in communication with the first sensor, the controller, and the database, wherein the computer is capable of obtaining a process recipe corresponding to the first lot ID from the database, and wherein the computer is further capable of providing the process recipe to the controller.Type: GrantFiled: May 17, 2002Date of Patent: September 28, 2004Assignee: Macronix International Co., Ltd.Inventor: Fong Yeh
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Publication number: 20040139339Abstract: The present invention provides a data encryption method and apparatus, in which an encryption algorithm module combination is selected from among a plurality of encryption algorithm module combinations predetermined by the user in cooperation with data attribute matching and a dynamic selection mechanism to perform encryption processing of data. The encryption of data through such alternate use of different encryption algorithm module combinations not only enhances the complexity in decryption of the data, the processing speed is not sacrificed due to use of relatively complicated encryption algorithms to ensure security. Furthermore, in the data decryption method and apparatus according to the present invention, data is decrypted using decryption algorithm module combinations that are dynamically switched according to decryption information appended to the ciphertext.Type: ApplicationFiled: November 25, 2003Publication date: July 15, 2004Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Ming-Fong Yeh, Chin-Mei Lin, Chun-Wei Fang
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Patent number: 5716690Abstract: A composite furniture leg includes an elongate molded core body having outer and inner sides, a hard wood reinforcing block embedded in a top part of the core body at the inner side of the core body, an outer laminate shell layer for covering the outer side of the core body, and an inner wood cover layer for covering the inner side of the core body. The core body, the outer shell layer and the inner cover layer are hot pressed to form the furniture leg.Type: GrantFiled: December 8, 1995Date of Patent: February 10, 1998Inventor: Don-Fong Yeh
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Patent number: D380627Type: GrantFiled: April 25, 1996Date of Patent: July 8, 1997Assignee: Pan-Ocean Forest Development Co., Ltd.Inventor: Don-Fong Yeh