Abstract: A low-profile light-emitting diode (LED) lamp includes a base, a cover, a heat dissipation plate, an LED module, a circuit board, and a light guide hood. The base and the cover respectively form a base opening and a cover opening. The base and the cover include a recess-projection mating structure therebetween to form an outer water sealing wall and an inner water sealing wall that surround the base opening and the cover opening. The light guide hood, the circuit board, and the LED module are arranged inside the inner water sealing wall. The base and the cover are fixed together through recess-projection mating formed between posts and holes to also realize water resistance. The heat generated by the LED module is dissipated by the heat dissipation plate, which is set on an outer surface of the base and is provided with a plurality of convection chambers that induce heat convection.

Abstract: An LED lamp with a flow guide structure guides external air to dissipate heat from the LED lamp includes a lamp base, a heat dissipating body, a heat dissipating plate and an LED module installed in the lamp base, and heat dissipating holes formed on the lamp base. The heat dissipating body includes heat dissipating fins, and a heat dissipating passage defined between any two fins and disposed corresponding to the heat dissipating hole. The LED module is in a thermal contact with the heat dissipating plate. The heat dissipating plate is attached onto the heat dissipating fins and includes openings. A flow guide plate is formed at a lateral edge of each opening and extended from the heat dissipating plate for guiding external air into the heat dissipating passage and out from the heat dissipating hole to expedite a natural convection in the lamp and prevent a thermal aggregation.

Abstract: An LED lamp with a flow guide structure guides external air to dissipate heat from the LED lamp includes a lamp base, a heat dissipating body, a heat dissipating plate and an LED module installed in the lamp base, and heat dissipating holes formed on the lamp base. The heat dissipating body includes heat dissipating fins, and a heat dissipating passage defined between any two fins and disposed corresponding to the heat dissipating hole. The LED module is in a thermal contact with the heat dissipating plate. The heat dissipating plate is attached onto the heat dissipating fins and includes openings. A flow guide plate is formed at a lateral edge of each opening and extended from the heat dissipating plate for guiding external air into the heat dissipating passage and out from the heat dissipating hole to expedite a natural convection in the lamp and prevent a thermal aggregation.

Abstract: A light guiding diffuser used for assembling with a light emitting diode module to form an illuminating light source. The light guiding diffuser includes an elliptical ring-shaped base portion and a convex portion extended from a surface of the base portion and formed a space with the base portion for accommodating the light emitting diode module. The convex portion has a cross section which has a minimum thickness in a center thereof and the thickness of the cross section continuous increases from the center toward the base portion.

Abstract: A light guiding diffuser used for assembling with a light emitting diode module to form an illuminating light source. The light guiding diffuser includes an elliptical ring-shaped base portion and a convex portion extended from a surface of the base portion and formed a space with the base portion for accommodating the light emitting diode module. The convex portion has a cross section which has a minimum thickness in a center thereof and the thickness of the cross section continuous increases from the center toward the base portion.

Abstract: A lamp holder of a LED streetlamp includes a lamp cover, a LED unit and a plurality of heat-conducting posts. The LED unit is provided below the lamp cover. A transparent lamp cover covers outside the LED unit. Further, the heat-conducting posts are arranged upright in the lamp cover and separated from each other by a distance. Each of the heat-conducting posts is connected to the inner edge surface of the lamp cover opposite to the LED unit and extends toward the top edge of the lamp cover to be located between the top and bottom of the lamp cover. On both sides of the lamp cover laterally facing the heat-conducting posts, venting holes are provided to form an open structure, thereby allowing outside air to enter the lamp cover and flow among the heat-conducting posts.

Abstract: A low-profile light-emitting diode (LED) lamp includes a base, a cover, a heat dissipation plate, an LED module, a circuit board, and a light guide hood. The base and the cover respectively form a base opening and a cover opening. The base and the cover include a recess-projection mating structure therebetween to form an outer water sealing wall and an inner water sealing wall that surround the base opening and the cover opening. The light guide hood, the circuit board, and the LED module are arranged inside the inner water sealing wall. The base and the cover are fixed together through recess-projection mating formed between posts and holes to also realize water resistance. The heat generated by the LED module is dissipated by the heat dissipation plate, which is set on an outer surface of the base and is provided with a plurality of convection chambers that induce heat convection.

Abstract: A method for manufacturing flip-chip light emitting diode (LED) package. A recess array is formed at the top surface of a silicon wafer. Two through-wafer via holes are formed in the recess. A plurality of LED chips are flip-chip mounted in each of the recesses, respectively. Two electrodes of each LED chip are respectively covered the two via holes. An encapsulator for encapsulating each LED chip is arranged in the recess to provide a flat top surface. A metal layer is deposited on the bottom surface of the silicon wafer to electrically connecting with the electrodes through the two via holes. Metal lines which electrically connecting the electrodes are formed by patterning the metal layer. A plurality of silicon submounts, each including at least one recess, are cut off from the silicon wafer. A fluorescent layer is arranged on the top surface of the encapsulator.