Patents by Inventor Fongru LIN

Fongru LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board having a ground layer including a plurality of polygonal openings
    Patent number: 9847306
    Abstract: A circuit board includes an insulating layer, a ground layer formed on a first surface of the insulating layer and including a plurality of openings arranged in first and second surface directions, each of the openings having a shape of a polygon having five or more sides, and a wiring layer formed on a second surface of the insulating layer opposite to the first surface.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: December 19, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Fongru Lin, Yoshihiro Iida
  • CIRCUIT BOARD HAVING A GROUND LAYER INCLUDING A PLURALITY OF POLYGONAL OPENINGS
    Publication number: 20170271282
    Abstract: A circuit board includes an insulating layer, a ground layer formed on a first surface of the insulating layer and including a plurality of openings arranged in first and second surface directions, each of the openings having a shape of a polygon having five or more sides, and a wiring layer formed on a second surface of the insulating layer opposite to the first surface.
    Type: Application
    Filed: March 2, 2017
    Publication date: September 21, 2017
    Inventors: Fongru LIN, Yoshihiro IIDA
  • ELECTRONIC DEVICE MODULE HAVING AN IMAGING UNIT
    Publication number: 20160150133
    Abstract: An electronic device module includes a substrate, an imaging unit disposed on the substrate and electrically connected thereto, a resin member disposed on the substrate and covering an peripheral region of the imaging unit, a lens unit disposed above the imaging unit, and a frame having a portion that is disposed on a top surface of the resin member and supports the lens unit.
    Type: Application
    Filed: August 10, 2015
    Publication date: May 26, 2016
    Inventors: Daigo SUZUKI, Akihiko HAPPOYA, Jun OOTSUBO, Fongru LIN
  • Conductive seal of a biomedical signal recorder with a radio function
    Patent number: D773058
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: November 29, 2016
    Assignee: TDK Corporation
    Inventors: Minoru Takizawa, Yasushi Sasaki, Fongru Lin
  • Conductive seal of a biomedical signal recorder
    Patent number: D778451
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: February 7, 2017
    Assignee: TDK Corporation
    Inventors: Minoru Takizawa, Yasushi Sasaki, Fongru Lin