Abstract: A method of interconnecting a printed-circuit-board (PCB) substrate and an integrated-circuit (IC) die that includes dispensing epoxy into a die cavity of a PCB substrate, the die cavity having full-wrap edge-plating; positioning an IC die in the die cavity and substantially aligning a top surface of the IC die with a top surface of the PCB substrate; curing the dispensed epoxy; substantially filling a gap between the PCB substrate and the IC die with underfill; filling a remaining gap between the PCB substrate and the IC die with non-conductive, aerosol-printed material; curing the underfill and the non-conductive, aerosol-printed material; using additive manufacturing to dispense conductive traces at desired locations spanning the gap and interconnecting the PCB substrate and the IC die; and sintering the dispensed conductive traces. Related methods are also discussed.

Abstract: A connector assembly that includes an electrical connector having a connector conductor, a connector housing, a PCB substrate bonded to a base, positioning pads extending away from the PCB substrate, and metallic bumps extending away from the PCB substrate. The connector housing has a housing conductor that is electrically connected to the connector conductor. The PCB substrate is brittle, and the housing conductor contacts an electrical signal path on the PCB substrate at an oblique angle. The positioning pads keep the mounting face of the connector housing away from the PCB substrate at a standoff distance. The metallic bumps are malleable and configured to provide an electrical connection between the PCB substrate and the mounting face of the connector housing.